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B10TJLC PDF预览

B10TJLC

更新时间: 2024-01-19 03:31:17
品牌 Logo 应用领域
飞思卡尔 - FREESCALE 晶体晶体管
页数 文件大小 规格书
27页 1432K
描述
RF Power LDMOS Transistors

B10TJLC 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:ActiveReach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8504.50.80.00
风险等级:5.68型芯材料:AIR
直流电阻:0.0079 Ω标称电感 (L):0.043 µH
电感器应用:RF INDUCTOR电感器类型:GENERAL PURPOSE INDUCTOR
JESD-609代码:e1功能数量:1
端子数量:2最高工作温度:140 °C
最低工作温度:-40 °C最小质量因数(标称电感时):106
自谐振频率:1200 MHz形状/尺寸说明:RECTANGULAR PACKAGE
屏蔽:NO特殊特征:Q MEASURED AT 150MHZ
表面贴装:YES端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子位置:DUAL ENDED端子形状:WIRE
容差:10%Base Number Matches:1

B10TJLC 数据手册

 浏览型号B10TJLC的Datasheet PDF文件第21页浏览型号B10TJLC的Datasheet PDF文件第22页浏览型号B10TJLC的Datasheet PDF文件第23页浏览型号B10TJLC的Datasheet PDF文件第24页浏览型号B10TJLC的Datasheet PDF文件第25页浏览型号B10TJLC的Datasheet PDF文件第27页 
PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS  
Refer to the following documents, software and tools to aid your design process.  
Application Notes  
AN1907: Solder Reflow Attach Method for High Power RF Devices in Over--Molded Plastic Packages  
AN1955: Thermal Measurement Methodology of RF Power Amplifiers  
AN3263: Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over--Molded Plastic Packages  
AN3789: Clamping of High Power RF Transistors and RFICs in Over--Molded Plastic Packages  
Engineering Bulletins  
EB212: Using Data Sheet Impedances for RF LDMOS Devices  
Software  
Electromigration MTTF Calculator  
RF High Power Model  
.s2p File  
Development Tools  
Printed Circuit Boards  
For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the  
Software & Tools tab on the part’s Product Summary page to download the respective tool.  
REVISION HISTORY  
The following table summarizes revisions to this document.  
Revision  
Date  
Description  
0
June 2012  
Initial Release of Data Sheet  
AFT05MS031NR1 AFT05MS031GNR1  
RF Device Data  
Freescale Semiconductor, Inc.  
26  

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