Datasheet > AWB51D2_17

AWB51D2_17

更新时间： 2022-02-26 13:51:25

品牌	Logo	应用领域
ASB		有线电视
页数	文件大小	规格书
7页	406K
描述
1.2 GHz CATV Push-pull Amplifier MMIC

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AWB51D2_17 数据手册

AWB51D2

4. Package Outline (TSSOP24)

Lot No.

Dimensions (In mm)

Symbols

Part No.

MIN

---

NOM

---

MAX

1.15

0.10

1.05

0.30

0.20

7.90

4.486

6.60

4.50

2.95

---

0.00

0.80

0.19

0.09

7.70

4.086

6.20

4.30

2.55

---

----

1.00

---

7.80

4.286

6.40

4.40

2.75

0.65

0.60

---



0.45

---

0

0.75

0.10

8

---

0.12

L1-L1

1.00REF

5. Surface Mount Recommendation (In mm)

2.20

NOTE

1. Add as much copper as possible to inner and outer

layers near the part to ensure optimal thermal

performance.

3.42

1.55

2. To ensure reliable operation, device ground

paddle-to-ground pad soldering is critical.

3. Add mounting screws near the part to fasten the

board to a heat sinker. Ensure that the ground &

thermal via region contacts the heat sinker.

4. A proper heat dissipation path underneath the area

of the PCB for the mounted device is strictly

required for proper thermal operation. Damage to

the device can result from inappropriate heat

dissipation.

0.76

0.34

6/7

ASB Inc.



sales@asb.co.kr

June 2017

1...3 4 567

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