生命周期: | Active | 包装说明: | UDFN-8 |
Reach Compliance Code: | compliant | 风险等级: | 5.56 |
商用集成电路类型: | CONSUMER CIRCUIT | JESD-30 代码: | R-PDSO-N8 |
长度: | 3 mm | 功能数量: | 1 |
端子数量: | 8 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | HVSON | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 座面最大高度: | 0.6 mm |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 2 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子形式: | NO LEAD |
端子节距: | 0.5 mm | 端子位置: | DUAL |
宽度: | 2 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
ATECC608A-TNGACT | MICROCHIP |
获取价格 |
Recommend using?ATECC608B-TNGACTThe Microchip ATECC608A-TNGACT is a Trust&GO secure elemen |
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ATECC608A-TNGLORA | MICROCHIP |
获取价格 |
Recommend using?ATECC608B-TNGLORAThe Microchip ATECC608A-TNGLORA is a Trust&GO secure elem |
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ATECC608A-TNGTLS | MICROCHIP |
获取价格 |
Recommend using ATECC608B-TNGTLSThe Microchip ATECC608A-TNGTLS is the Trust&GO secure elem |
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ATECC608B-TCSM | MICROCHIP |
获取价格 |
The Microchip ATECC608B-TCSM is a secure element part of the Trust Platform for the Crypto |
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ATECC608B-TFLXTLS | MICROCHIP |
获取价格 |
The Microchip ATECC608B-TFLXTLS is the TrustFLEX secure element part of the?Trust Platform |
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ATECC608B-TNGTLS | MICROCHIP |
获取价格 |
The Microchip ATECC608B-TNGTLS is the Trust&GO secure element part of the Trust Platform f |
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ATEP-04-0100-SMA-P-01 | SAMTEC |
获取价格 |
Interconnection Device, LEAD FREE |
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ATEP-04-0100-SMA-P-1 | SAMTEC |
获取价格 |
Interconnection Device, LEAD FREE |
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ATEP-04-0150-SMA-P-01 | SAMTEC |
获取价格 |
Interconnection Device, LEAD FREE |
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ATEP-04-0150-SMA-P-1 | SAMTEC |
获取价格 |
Interconnection Device, LEAD FREE |
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