AS8510
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only. Functional operation of the
device at these or any other conditions beyond those indicated in Electrical Characteristics on page 7 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Electrical Parameters
Min
Max
Units
Notes
DC supply voltage (AVDD and DVDD)
Input voltage (VIN)
-0.3
-0.3
5
V
V
AVDD + 0.3
DVDD + 0.3
Input current (latchup immunity)
-100
100
mA
kV
AEC - Q100 - 004
AEC - Q100 - 002
(ISCR
)
Electrostatic Discharge
Electrostatic discharge (ESD) all pins
±2
Continuous Power Dissipation
SSOP20 in still air, soldered on JEDEC
standard board @ 125º ambient, static
operation with no time limit
Total power dissipation
(all supplies and outputs) (Pt)
50
mW
Temperature Ranges and Storage Conditions
Storage temperature (TSTRG
Junction temperature (TJ)
Thermal resistance (RthJC)
)
-50
125
130
80
ºC
ºC
K/W
JEDEC standard test board, 0 air velocity
Norm: IPC/JEDEC J-STD-020
The reflow peak soldering temperature (body
temperature) is specified according IPC/
JEDEC J-STD-020 “Moisture/Reflow Sensitivity
Classification for Nonhermetic Solid State
Surface Mount Devices”.
Package body temperature (TBODY
)
260
85
ºC
%
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
Humidity non-condensing
5
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