AS7C33512PFS32A
AS7C33512PFS36A
®
Ordering information
Package & Width
250 MHz
225 MHz
200 MHz
166 MHz
AS7C33512PFS32A-
225TQC
AS7C33512PFS32A-
200TQC
AS7C33512PFS32A-
166TQC
AS7C33512PFS32A-
250TQC
TQFP x32
TQFP x36
BGA x32
AS7C33512PFS32A-
225TQI
AS7C33512PFS32A-
200TQI
AS7C33512PFS32A-
166TQI
AS7C33512PFS36A-
225TQC
AS7C33512PFS36A-
200TQC
AS7C33512PFS36A-
166TQC
AS7C33512PFS36A-
250TQC
AS7C33512PFS36A-
225TQI
AS7C33512PFS36A-
200TQI
AS7C33512PFS36A-
166TQI
AS7C33512PFS32A-
225BC
AS7C33512PFS32A-
200BC
AS7C33512PFS32A-
166BC
AS7C33512PFS32A-
250BC
AS7C33512PFS32A-
225BI
AS7C33512PFS32A-
200BI
AS7C33512PFS32A-
166BI
AS7C33512PFS36A-
225BC
AS7C33512PFS36A-
200BC
AS7C33512PFS36A-
166BC
AS7C33512PFS36A-
250BC
BGA x36
AS7C33512PFS36A-
225BI
AS7C33512PFS36A-
200BI
AS7C33512PFS36A-
166BI
Part numbering guide
AS7C
33
512
PF
S
32/ 36
A
–XXX
TQ or B
C/ I
1
2
3
4
5
6
7
8
9
10
1.Alliance Semiconductor SRAM prefix
2.Operating voltage: 33 = 3.3V
3.Organization: 512 = 512K
4.Pipelined/ flow-through mode (each device works in both modes)
5.Deselect: S = single cycle deselect
6.Organization: 32 = x 32; 36 = x 36
7.Production version: A = first production version
8.Clock speed (MHz)
9.Package type: TQ = TQFP, B = BGA
10.Operating temperature: C = commercial (0° C to 70° C); I = industrial (-40° C to 85° C)
12/ 2/ 02, v. 0.9.8 Advance Info
Alliance Semiconductor
21 of 21
© Copyright Alliance Semiconductor Corporation. All rights reserved. Our three-point logo, our name and Intelliwatt are trademarks or registered trademarks of Alliance. All other brand and
product names may be the trademarks of their respective companies. Alliance reserves the right to make changes to this document and its products at any time without notice. Alliance assumes no
responsibility for any errors that may appear in this document. The data contained herein represents Alliance’s best data and/or estimates at the time of issuance. Alliance reserves the right to
change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this
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