DATA SHEET • AS192-000
Truth Table
Pin Out
V1 ANT V4
V
1
V
2
V
3
V
4
Ant-J
Ant-J
Ant-J
Ant-J
4
1
2
3
J1
J4
V
V
V
V
V
V
V
Ins. loss
Isolation
Isolation
Isolation
Isolation
Ins. loss
Isolation
Isolation
Isolation
Isolation
Ins. loss
Isolation
Isolation
Isolation
Isolation
Ins. loss
HIGH LOW
LOW
LOW
HIGH
LOW
LOW
LOW
HIGH
V
V
V
V
LOW HIGH
V
V
LOW
LOW
Low
V
LOW
V
LOW
V
VLOW = 0.
VHIGH = 4.5 to 5.0 V for RF power > 30 dBm.
VHIGH = 3.0 to 5.0 V for RF power 20–30 dBm.
VHIGH = 2.7 to 5.0 V for RF power < 20 dBm.
All other conditions not recommended.
J2
J3
V2
V3
Notes:
Outline Drawing
DC blocking caps required on RF lines for positive voltage operation
bond pad metalization: gold
backside metalization: none
bond pad dimensions: 0.003 (0.075 mm) x 0.003 (0.075 mm)
See application note, Handling GaAs MMIC Die.
0.0417 (1.06 mm)
0.0387 (0.98 mm)
J3
J4
0.0261 (0.66 mm)
0.0209 (0.53 mm)
0.0156 (0.40 mm)
V4
V3
V2
ANT
V1
0.0030 (0.08 mm)
0.0000 (0.00 mm)
J2
J1
Chip thickness 0.008 0.001 (0.203 0.025).
Ordering Information
Model Name
Operating Temperature Range
Ordering Part Number
Package Description
Wafer on plastic-ring film frame
AS192-000 GaAs SP4T switch
-40 °C to +85 °C
AS192-000
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200144 Rev. B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • July 16, 2006
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