AS1320
Data Sheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical
Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
All Pins to GND
LX Current
Min
Max
7
Units
V
Comments
-0.3
1
A
Latch-Up
-100
100
mA
JEDEC 78
Package Power Dissipation
(TAMB = +70ºC)
500
mW
(ΘJA = 9.1mW/ºC above +70ºC)
Operating Temperature Range
Electrostatic Discharge
-40
-500
5
+85
+500
85
ºC
V
HBM MIL-Std. 883E 3015.7 methods
Humidity (Non-Condensing)
Storage Temperature Range
Junction Temperature
%
ºC
ºC
-55
125
150
The reflow peak soldering temperature (body
temperature) specified is in compliance with
IPC/JEDEC J-STD-020C “Moisture/ Reflow
Sensitivity Classification for Non-Hermetic
Solid State Surface Mount Devices”.
Package Body Temperature
260
ºC
www.austriamicrosystems.com
Revision 1.03
3 - 12