Datasheet > AS1130C-BSST

AS1130C-BSST

更新时间： 2022-05-04 08:28:51

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132-LED Cross-Plexing Dr iver wi th scrol l ing Funct ion

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AS1130C-BSST 数据手册

AS1130

Datasheet ꢀ Absolute Maximum Ratings

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Section 6 Electrical Characteristics on page 4 is not implied.

Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Electrical Parameters

Min

Max

Units

Comments

VDD to GND

ꢀ0.3

7 or

VDD + 0.3

All other pins to GND

Sink Current

Segment Current

500

100

Input Current (latchꢀup immunity)

ꢀ100

Norm: JEDEC 78

Electrostatic Discharge

Electrostatic Discharge HBM

Temperature Ranges and Storage Conditions

Junction Temperature

Norm: MIL 883 E method 3015

+150

+125

+150

ºC

ꢀ55

for 20ꢀpin WLꢀCSP

for 28ꢀpin SSOP

Storage Temperature Range

The reflow peak soldering temperature (body

temperature) specified is in accordance with IPC/JEDEC

J-STD-020“Moisture/Reflow Sensitivity Classification for

Non-Hermetic Solid State Surface Mount Devices”.

The lead finish for Pbꢀfree leaded packages is matte tin

(100% Sn).

Package Body Temperature

ºC

+260

Humidity nonꢀcondensing

Moisture Sensitive Level

20ꢀpin

Represents a max. floor life time of unlimited

WLꢀCSP

28ꢀpin

Represents a max. floor life time of 168h

SSOP

www.austriamicrosystems.com/LEDꢀDriverꢀICs/AS1130

Revision 1.07

3 ꢀ 38

1 2 345 6 7...39

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