AP2145/AP2155
0.5A SINGLE CHANNEL CURRENT-LIMITED POWER
SWITCH WITH OUTPUT DISCHARGE
Recommended Operating Conditions
Symbol
Parameter
Min
2.7
0
Max
5.5
Unit
V
Input voltage
VIN
IOUT
TA
Output Current
500
85
mA
°C
Operating Ambient Temperature
-40
Electrical Characteristics (TA = 25oC, VIN = +5.0V, unless otherwise stated)
Symbol
VUVLO
ISHDN
IQ
Parameter
Input UVLO
Test Conditions
Min
Typ.
1.9
0.5
45
Max
Unit
Rload=1kΩ
1.6
2.5
1
V
Input Shutdown Current
Input Quiescent Current
Disabled, OUT = open
μA
μA
Enabled, OUT = open
70
1
ILEAK Input Leakage Current
IREV Reverse Leakage Current
Disabled, OUT grounded
Disabled, VIN= 0V, VOUT= 5V, IREV at VIN
-1
μA
1
μA
MSO-8-EP
SO-8
VIN = 3.3V, IOUT= 0.5A, -40oC≤ TA ≤85oC
90
95
140
140
mΩ
mΩ
V
IN = 5V, IOUT= 0.5A, -
40oC≤ TA ≤85oC
RDS(ON) Switch on-resistance
120
0.7
160
mΩ
ISHORT Short-Circuit Current Limit
ILIMIT Over-Load Current Limit
A
Enabled into short circuit, CIN=10μF, CL=100μF
VIN= 5V, VOUT= 4.5V, CIN=10μF, CL=100μF, -
40oC≤ TA ≤85oC
0.6
0.8
1.0
10
1.0
A
A
Current limiting trigger
threshold
Output Current Slew rate (<100A/s), CIN=10μF,
CL=22μF
ITrig
VOUT = 0V to IOUT = ILIMIT (short applied to output),
TSHORT Short-Circuit Response Time
μs
CL=100μF
VIL
VIH
EN Input Logic Low Voltage VIN = 2.7V to 5.5V
EN Input Logic High Voltage VIN = 2.7V to 5.5V
0.8
V
2
V
ISINK
EN Input leakage
VEN = 5V
1
1
μA
μA
ms
ms
ms
ms
Ω
IO-LEAK Output Leakage Current
TD(ON) Output turn-on delay time
Disabled
0.05
0.6
0.01
0.05
20
CL=1μF, Rload=10Ω
CL=1μF, Rload=10Ω
CL=1μF, Rload=10Ω
CL=1μF, Rload=10Ω
TR
TD(OFF) Output turn-off delay time
TF Output turn-off fall time
RFLG FLG output FET on-resistance
Output turn-on rise time
1.5
0.1
40
V
IN = 3.3V or 5V, CIN=10μF, IFLG =10mA
IFLG
FLG Leakage Current
VFLG = 5V
1
μA
ms
°C
°C
TBlank FLG blanking time
4
7
15
VIN = 3.3V or 5V, CIN=10μF, CL=100μF
TSHDN Thermal Shutdown Threshold Enabled, Rload=1kΩ
135
25
THYS Thermal Shutdown Hysteresis
SO-8 (Note 3)
110
oC/W
Thermal Resistance Junction-
to-Ambient
θJA
MSO-8-EP (Note 4)
60
oC/W
Notes:
3. Test condition for SO-8: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout.
4. Test condition for MSO-8-EP: Device mounted on 2” x 2” FR-4 substrate PC board, 2oz copper, with minimum recommended pad on top layer
and thermal vias to bottom layer ground plane.
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www.diodes.com
September 2010
© Diodes Incorporated
AP2145/AP2155
Document number: DS32031 Rev. 2 - 2