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AMMP-6120-TR2 PDF预览

AMMP-6120-TR2

更新时间: 2024-02-18 05:57:58
品牌 Logo 应用领域
安华高科 - AVAGO 射频微波倍频器
页数 文件大小 规格书
7页 282K
描述
8-24 GHz x2 Frequency Multiplier 5x5mm Surface Mount Package

AMMP-6120-TR2 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:LCC8,.2SQ,28
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.32
特性阻抗:50 Ω构造:COMPONENT
最大输入功率 (CW):15 dBmJESD-609代码:e4
安装特点:SURFACE MOUNT端子数量:8
最大工作频率:24000 MHz最小工作频率:8000 MHz
封装主体材料:PLASTIC/EPOXY封装等效代码:LCC8,.2SQ,28
电源:5 V射频/微波设备类型:FREQUENCY DOUBLER
子类别:RF/Microwave Frequency Multipliers最大压摆率:120 mA
表面贴装:YES端子面层:Nickel/Gold (Ni/Au)
Base Number Matches:1

AMMP-6120-TR2 数据手册

 浏览型号AMMP-6120-TR2的Datasheet PDF文件第1页浏览型号AMMP-6120-TR2的Datasheet PDF文件第3页浏览型号AMMP-6120-TR2的Datasheet PDF文件第4页浏览型号AMMP-6120-TR2的Datasheet PDF文件第5页浏览型号AMMP-6120-TR2的Datasheet PDF文件第6页浏览型号AMMP-6120-TR2的Datasheet PDF文件第7页 
Electrical Specifications  
1. Small/Large -signal data measured in a fully de-embedded test fixture form TA = 25°C.  
2. Pre-assembly into package performance verified 100% on-wafer.  
3. This final package part performance is verified by a functional test correlated to actual performance at one or more  
frequencies.  
4. Specifications are derived from measurements in a 50 Ω test environment. Aspects of the amplifier performance  
may be improved over a more narrow bandwidth by application of additional conjugate, linearity, or low noise  
(Гopt) matching.  
Table 1. RF Electrical Characteristics  
TA=25°C, Vd=50V, Vg=-1.4V, Idq=85mA, Zin=Zout=50 Ω  
Parameter  
Output Power, Pout  
Min  
13  
Typ.  
16  
2
Max  
Unit  
dBm  
dBm  
Input Power at 1dB Gain Compression,  
IP-1dB  
Input Return Loss, RLin  
-15  
-10  
25  
dB  
Output Return Loss, RLout  
dB  
Fundamental Suppresion, Sup  
3rd Harmonic Suppression, Sup3  
4th Harmonic Suppression, Sup4  
18  
dBc  
dBc  
dBc  
dBc  
25  
35  
Single Side Band Phase Noise, SSBPN  
(@100kHz offset, fout=15.6GHz)  
-140  
Table 2. Recommended Operating Range  
1. Ambient operational temperature TA = 25°C unless otherwise noted.  
2. Channel-to-backside Thermal Resistance (Tchannel (Tc) = 34°C) as measured using infrared microscopy. Thermal Re-  
sistance at backside temperature (Tb) = 25°C calculated from measured data.  
Description  
Min.  
Typical  
Max.  
Unit  
Comments  
Drain Supply Current, Id  
85  
110  
mA  
Vd = 5V, Under any RF power  
drive and temperature  
Gate Current, Ig  
9
uA  
Table 3. Thermal Properties  
Parameter  
Test Conditions  
Value  
Thermal Resistance, qch-b  
Channel-to-backside Thermal Resistance Tchannel(Tc)=34°C  
Thermal Resistance at backside temperature Tb=25°C  
qch-b = 34 °C/W  
Absolute Minimum and Maximum Ratings  
Table 4. Minimum and Maximum Ratings  
Description  
Min.  
Max.  
7
Unit  
V
Comments  
Drain Supply Voltage, Vd  
Gate Supply Voltage, Vg  
Drain Current, Idq  
-3.0  
+0.5  
120  
15  
V
mA  
dBm  
°C  
CW Input Power, Pin  
Channel Temperature, Tch  
Storage Temperature , Tstg  
Maximum Assembly Temperature, Tmax  
Notes:  
+150  
+150  
+300  
-65  
°C  
°C  
60 second maximum  
1. Operation in excess of any one of these conditions may result in permanent damage to this device.  
2

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