Electrical Specifications
1. Small/Large -signal data measured in a fully de-embedded test fixture form TA = 25°C.
2. Pre-assembly into package performance verified 100% on-wafer.
3. This final package part performance is verified by a functional test correlated to actual performance at one or more
frequencies.
4. Specifications are derived from measurements in a 50 Ω test environment. Aspects of the amplifier performance
may be improved over a more narrow bandwidth by application of additional conjugate, linearity, or low noise
(Гopt) matching.
Table 1. RF Electrical Characteristics
TA=25°C, Vd=50V, Vg=-1.4V, Idq=85mA, Zin=Zout=50 Ω
Parameter
Output Power, Pout
Min
13
Typ.
16
2
Max
Unit
dBm
dBm
Input Power at 1dB Gain Compression,
IP-1dB
Input Return Loss, RLin
-15
-10
25
dB
Output Return Loss, RLout
dB
Fundamental Suppresion, Sup
3rd Harmonic Suppression, Sup3
4th Harmonic Suppression, Sup4
18
dBc
dBc
dBc
dBc
25
35
Single Side Band Phase Noise, SSBPN
(@100kHz offset, fout=15.6GHz)
-140
Table 2. Recommended Operating Range
1. Ambient operational temperature TA = 25°C unless otherwise noted.
2. Channel-to-backside Thermal Resistance (Tchannel (Tc) = 34°C) as measured using infrared microscopy. Thermal Re-
sistance at backside temperature (Tb) = 25°C calculated from measured data.
Description
Min.
Typical
Max.
Unit
Comments
Drain Supply Current, Id
85
110
mA
Vd = 5V, Under any RF power
drive and temperature
Gate Current, Ig
9
uA
Table 3. Thermal Properties
Parameter
Test Conditions
Value
Thermal Resistance, qch-b
Channel-to-backside Thermal Resistance Tchannel(Tc)=34°C
Thermal Resistance at backside temperature Tb=25°C
qch-b = 34 °C/W
Absolute Minimum and Maximum Ratings
Table 4. Minimum and Maximum Ratings
Description
Min.
Max.
7
Unit
V
Comments
Drain Supply Voltage, Vd
Gate Supply Voltage, Vg
Drain Current, Idq
-3.0
+0.5
120
15
V
mA
dBm
°C
CW Input Power, Pin
Channel Temperature, Tch
Storage Temperature , Tstg
Maximum Assembly Temperature, Tmax
Notes:
+150
+150
+300
-65
°C
°C
60 second maximum
1. Operation in excess of any one of these conditions may result in permanent damage to this device.
2