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AMIS30663NGA PDF预览

AMIS30663NGA

更新时间： 2024-01-15 23:32:49
品牌 Logo 应用领域
AMI 电信集成电路光电二极管
页数 文件大小 规格书
12页 216K
描述
High Speed CAN Transceiver

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AMIS30663NGA 技术参数

是否Rohs认证： 符合生命周期：Transferred
包装说明：0.150 INCH, GREEN, PLASTIC, MS-012AA, SOIC-8Reach Compliance Code：unknown
风险等级：5.79JESD-30 代码：R-PDSO-G8
JESD-609代码：e4长度：4.9276 mm
湿度敏感等级：3功能数量：1
端子数量：8最高工作温度：125 °C
最低工作温度：-40 °C封装主体材料：PLASTIC/EPOXY
封装代码：SOP封装形状：RECTANGULAR
封装形式：SMALL OUTLINE峰值回流温度（摄氏度）：260
认证状态：Not Qualified座面最大高度：1.7272 mm
标称供电电压：5 V表面贴装：YES
电信集成电路类型：INTERFACE CIRCUIT温度等级：AUTOMOTIVE
端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)端子形式：GULL WING
端子节距：1.27 mm端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：3.937 mm
Base Number Matches：1

AMIS30663NGA 数据手册

 浏览型号AMIS30663NGA的Datasheet PDF文件第6页浏览型号AMIS30663NGA的Datasheet PDF文件第7页浏览型号AMIS30663NGA的Datasheet PDF文件第8页浏览型号AMIS30663NGA的Datasheet PDF文件第9页浏览型号AMIS30663NGA的Datasheet PDF文件第10页浏览型号AMIS30663NGA的Datasheet PDF文件第11页 
Data Sheet  
AMIS-30663  
High Speed CAN Transceiver  
Table 8: Soldering Process  
Soldering Method  
Package  
Wave  
Reflow (1)  
Suitable  
BGA, SQFP  
Not suitable  
HLQFP, HSQFP, HSOP, HTSSOP, SMS Not suitable (2)  
Suitable  
PLCC (3), SO, SOJ  
LQFP, QFP, TQFP  
SSOP, TSSOP, VSO  
Suitable  
Suitable  
Not recommended (3)(4) Suitable  
Not recommended (5) Suitable  
Notes  
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package,  
there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the drypack information  
in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods."  
2. These packages are not suitable for wave soldering as a solder joint between the printed circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick  
to the heatsink (on top version).  
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream  
and at the side corners.  
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a pitch (e) equal to or  
smaller than 0.65mm.  
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a pitch (e) equal to or  
smaller than 0.5mm.  
AMI Semiconductor - Rev. 1.4, Oct. 04  
12  
www.amis.com  
Devices sold by AMIS are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMIS makes no warranty, express, statutory, implied or by description, regarding the  
information set forth herein or regarding the freedom of the described devices from patent infringement. AMIS makes no warranty of merchantability or fitness for any purposes. AMIS reserves the right to  
discontinue production and change specifications and prices at any time and without notice. AMI Semiconductor's products are intended for use in commercial applications. Applications requiring extended  
temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not recommended without additional  
processing by AMIS for such applications. Copyright ©2005 AMI Semiconductor, Inc.  
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