AMIS−30621
32
25
HW0
HW1
VDD
GND
TST
1
2
3
4
5
6
7
8
9
10
SWI
20
19
18
17
16
15
14
13
12
11
31 30 29 28 27 26
VBB
XP
XP
1
24
YN
MOTXP
GND
YN
2
3
23
22
VBB
VBB
VBB
VBB
VBB
VCP
CPP
CPN
4
5
6
7
8
21
20
19
18
17
MOTXN
MOTYP
GND
AMIS−30621
(Top View)
VBB
SWI
NC
LIN
GND
HW2
CPN
CPP
MOTYN
VBB
HW0
10 11 12 13 14 15
VCP
9
16
NQFP−32
SOIC−20
Figure 2. SOIC−20 and NQFP−32 Pin−out
Table 4. PIN DESCRIPTION
Pin Name
Pin Description
SOIC−20
NQFP−32
HW0
HW1
Bit 0 of LIN−ADD
Bit 1 of LIN−ADD
To be Tied to GND or V
1
8
9
DD
2
V
Internal supply (needs external decoupling capacitor)
Ground, heat sink
3
10
DD
GND
TST
LIN
4,7,14,17
11, 14, 25, 26, 31, 32
Test pin (to be tied to ground in normal operation)
LIN−bus connection
5
6
12
13
HW2
CPN
CPP
VCP
Bit 2 LIN−ADD
8
15
Negative connection of pump capacitor (charge pump)
Positive connection of pump−capacitor (charge pump)
Charge−pump filter−capacitor
Battery voltage supply
9
17
10
11
12,19
13
15
16
18
20
18
19
V
BB
3, 4, 5, 20, 21, 22
MOTYN
MOTYP
MOTXN
MOTXP
SWI
Negative end of phase Y coil
23, 24
27, 28
29, 30
1, 2
Positive end of phase Y coil
Negative end of phase X coil
Positive end of phase X coil
Switch input
6
NC
Not connected (to be tied to ground)
7, 16
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