CHIP RESISTOR
测试方法
Test Method
标 准
Specification
试验项目
Test Item
AEC-Q200 Test 7/MIL-STD-202 Method 103
温度85℃,湿度85%的条件下施加10%额定功率或元件极限电流
(取较小值),放置1000小时。
无可见损伤
No mechanical damage
△R≤±1.0%R
高温高湿
Biased Humidity
85
℃/85%RH. 1000 hours, Apply 10% of operating power or
imiting element current whichever is lower .
AEC-Q200 Test 12/MIL-STD-202 Method 215
浸在三种溶剂3分钟后擦拭10次,浸、刷共3回,用水洗清洗剂进行清洗,
并在室温下对整个表面进行通风干燥。
Immersed in three solvents after 3min immersion, brush wipe
10times, a total of 3 times,washing with washing and cleaning
agent, room temperature on the surface of the ventilation
drying.
耐溶剂性
Component
Solvent
Resistance
标记清晰,无可见损伤
Clearly marked
No mechanical damage
AEC-Q200 Test 13/MIL-STD-202 Method 213
正半弦波,峰值加速度100g's,脉冲持续时间6ms,三轴六向各3次,
共18次。
Positive half wave, peak acceleration:100g's,pulse duration:
6ms,three axis six to each 3 times, a total of 18 times.
无可见损伤
No mechanical damage
△R≤±1.0%R
机械冲击
Mechanical
shock
AEC-Q200 Test 14/MIL-STD- 202 Method 204
频率:10Hz~2000Hz;加速度:5g's;一个循环20分钟;X,Y,Z三个方向
每个方向12个循环,共36个循环。
Frequency:10Hz~2000Hz,acceleration:5g's, a loop 20 min,
X,Y,Z three directions, each direction 12 cycles,36 cycles.
无可见损伤
No mechanical damage
△R≤±1.0%R
振动
Vibration
AEC-Q200 Test 15/MIL-STD-202 Method 210
耐焊接热
无可见损伤
Resistance to
Soldering Heat
270℃±
5℃锡槽,保持10s±1s。
No mechanical damage
Lead-free solder bath at 270℃±
5
℃ for 10s±1s.
△R≤±1.0%R
AEC-Q200 Test 16/MIL-STD-202 Method 107
-55℃(15分钟)~常温(≤20 秒)~155℃(15分钟),
300个循环。
无可见损伤
No mechanical damage
△R≤±1.0%R
热冲击
Thermal Shock
-55℃
~155
(15min)
~
normal temperature(
≤20s)
℃(30min) ,
300 cycles.
无可见损伤
No mechanical damage
可焊面积≥95%
AEC-Q200 Test 18/IEC 60115-1 4.17
245℃± ℃锡槽,保持3s 0.3s
Lead-free solder bath at 245℃± ℃ for 3s±0.3s.
可焊性
Solder-ability
5
±
。
5
95% Cover Min
在规定值内
within specified T.C.R
电阻温度系数
AEC-Q200 Test 19/IEC 60115-1 4.8
+20 /+125 /+20
T.C.R
℃
℃
℃
AEC-Q200 Test 21/AEC-Q200-005
弯曲距离(Bending distance) 2mm
保持时间(Duration) 60s 5s.
基板弯曲试验
Substrate
Bending Test
无可见损伤
No mechanical damage
△R≤±1.0%R
:
:
±
AEC-Q200 Test 22/AEC-Q200-006
施加力 17.7N,保持 60s 1s
Appling force 17.7N for 60s
无可见损伤
No mechanical damage
△R≤±1.0%R
端子强度
Terminal
Strength
:
±
。
±
1s。
AEC-Q200 Test 20/UL-94
V-0或V-1可接受。不需要电气测试。
不完全燃尽,薄垫纸应不被引燃,
松木板应不被烤焦炭化
可燃性
V-0 or V-1 are acceptable. Electrical test not
required.
Flammability
No ignition of the tissue paper or
scorching or the pinewood board
IEC 60115-1 4.13
无可见损伤
No mechanical damage
1206
1206
2010
2010
:
:
、
、
5
5
倍额定功率,保持
×
5
秒。
短时间过负载
Short Time
Overload
Rated Power
,for 5 s.
2728
2728
2512
2512
、
、
2725
2725
、
、
、2817: 4倍额定功率,保持5秒。
、2817: 4 Rated Power
△R≤±1.0%R
×
,
for 5 s.
IEC 60115-1 4.36
-55℃±5℃,无负载1小时,额定电流或元件极限电流(取较小值)
45分钟,无负载15分钟。
无可见损伤
No mechanical damage
△R≤±1.0%R
低温负载
Operation at Low
Temperature
-55℃±5℃, 1h without load,rated current or limiting element
current whichever is lower for 45min, 15min without load.
4