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AM3358BZCZ60 PDF预览

AM3358BZCZ60

更新时间： 2024-02-19 01:28:35
品牌 Logo 应用领域
德州仪器 - TI 时钟外围集成电路
页数 文件大小 规格书
162页 1837K
描述
Sitara 处理器：Arm Cortex-A8、3D 图形、PRU-ICSS、CAN | ZCZ | 324 | 0 to 90

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AM3358BZCZ60 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：LFBGA, BGA324,18X18,32
Reach Compliance Code：compliantECCN代码：5A992.C
HTS代码：8542.31.00.01风险等级：1.7
地址总线宽度：28位大小：32
边界扫描：YES最大时钟频率：26 MHz
外部数据总线宽度：16格式：FIXED POINT
集成缓存：YESJESD-30 代码：S-PBGA-B324
JESD-609代码：e1长度：15 mm
低功率模式：YES湿度敏感等级：3
DMA 通道数量：64端子数量：324
片上数据RAM宽度：8最高工作温度：90 °C
最低工作温度：封装主体材料：PLASTIC/EPOXY
封装代码：LFBGA封装等效代码：BGA324,18X18,32
封装形状：SQUARE封装形式：GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度（摄氏度）：260电源：0.95/1.1 V
认证状态：Not QualifiedRAM（字数）：131072
座面最大高度：1.4 mm速度：600 MHz
子类别：Microprocessors最大压摆率：400 mA
最大供电电压：1.144 V最小供电电压：1.056 V
标称供电电压：1.1 V表面贴装：YES
技术：CMOS温度等级：OTHER
端子面层：Tin/Silver/Copper (Sn/Ag/Cu)端子形式：BALL
端子节距：0.8 mm端子位置：BOTTOM
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：15 mm
uPs/uCs/外围集成电路类型：MICROPROCESSOR, RISCBase Number Matches：1

AM3358BZCZ60 数据手册

 浏览型号AM3358BZCZ60的Datasheet PDF文件第2页浏览型号AM3358BZCZ60的Datasheet PDF文件第3页浏览型号AM3358BZCZ60的Datasheet PDF文件第4页浏览型号AM3358BZCZ60的Datasheet PDF文件第5页浏览型号AM3358BZCZ60的Datasheet PDF文件第6页浏览型号AM3358BZCZ60的Datasheet PDF文件第7页 
AM3359, AM3358, AM3357  
AM3356, AM3354, AM3352  
www.ti.com  
SPRS717 –OCTOBER 2011  
AM335x ARM® Cortex™-A8 Microprocessors (MPUs)  
Check for Samples: AM3359, AM3358  
1 Device Summary  
1.1 Features  
1234567  
– 256KB of L2 Cache with Error Correcting  
• Highlights  
– 500-MHz, 600-MHz, or 720-MHz ARM®  
Cortex™-A8 32-Bit RISC Microprocessor  
Code (ECC)  
– 176KB of On-Chip Boot ROM  
– 64KB of Dedicated RAM  
– Emulation/Debug  
•
•
NEON™ SIMD Coprocessor  
32KB/32KB of L1 Instruction/Data Cache  
with Single-Error Detection (parity)  
•
•
•
JTAG  
•
256KB of L2 Cache with Error Correcting  
Code (ECC)  
Embedded Trace Module  
Embedded Trace Buffer  
– mDDR(LPDDR)/DDR2/DDR3 Support  
– Interrupt Controller (up to 128 interrupt  
– General-Purpose Memory Support (NAND,  
NOR, SRAM, etc.) Supporting Up to 16-bit  
ECC  
requests)  
• On-Chip Memory (Shared L3 RAM)  
– 64 KB of General-Purpose On-Chip Memory  
– SGX530 Graphics Engine  
Controller (OCMC) RAM  
– Programmable Real-Time Unit Subsystem  
– Real-Time Clock (RTC)  
– Up to Two USB 2.0 High-Speed OTG Ports  
with Integrated PHY  
– 10/100/1000 Ethernet Switch Supporting Up  
to Two Ports  
– Two Controller Area Network Ports (CAN)  
– Six UARTs, Two McASPs, Two McSPI, and  
Two I2C Ports  
– 12-Bit Successive Approximation Register  
(SAR) ADC  
– Up to Three 32-Bit Enhanced Capture  
Modules (eCAP)  
– Up to Three Enhanced High-Resolution PWM  
Modules (eHRPWM)  
– Crypto Hardware Accelerators (AES, SHA,  
– Accessible to all Masters  
– Supports Retention for Fast Wake-Up  
• External Memory Interfaces (EMIF)  
– mDDR/DDR2/DDR3 Controller:  
•
•
•
mDDR: 200-MHz Clock (400-MHz Data  
Rate)  
DDR2: 266-MHz Clock (532-MHz Data  
Rate)  
DDR3: 303-MHz Clock (606-MHz Data  
Rate)  
•
•
•
16-Bit Data Bus  
1 GB of Total Addressable Space  
Supports One x16, Two x8, or Four x4  
Memory Device Configurations  
•
Supports Retention for Fast Wake-Up  
– General-Purpose Memory Controller (GPMC)  
PKA, RNG)  
•
Flexible 8/16-Bit Asynchronous Memory  
Interface with Up to seven Chip Selects  
(NAND, NOR, Muxed-NOR, SRAM, etc.)  
• MPU Subsystem  
– 500-MHz, 600-MHz, or 720-MHz ARM®  
Cortex™-A8 32-Bit RISC Microprocessor  
•
•
Uses BCH Code to Support 4-Bit, 8-Bit, or  
16-Bit ECC  
Uses Hamming Code to Support 1-Bit  
ECC  
– NEON™ SIMD Coprocessor  
– 32KB of L1 Instruction Cache with  
Single-Error Detection (parity)  
– 32KB of L1 Data Cache with Single  
– Error Locator Module (ELM)  
•
Used in Conjunction with the GPMC to  
Locate Addresses of Data Errors from  
Error-Detection (parity)  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
SmartReflex, DSP/BIOS, XDS are trademarks of Texas Instruments.  
Cortex, NEON are trademarks of ARM Ltd or its subsidiaries.  
ARM is a registered trademark of ARM Ltd or its subsidiaries.  
EtherCAT is a registered trademark of EtherCAT Technology Group.  
POWERVR is a registered trademark of Imagination Technologies Limited.  
All other trademarks are the property of their respective owners.  
2
3
4
5
6
7
PRODUCT PREVIEW information concerns products in the formative or design phase of  
development. Characteristic data and other specifications are design goals. Texas  
Instruments reserves the right to change or discontinue these products without notice.  
ProdPrev  
Copyright © 2011, Texas Instruments Incorporated  
English Data Sheet: SPRS717  
 
 
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