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AM27C512-70DE PDF预览

AM27C512-70DE

更新时间: 2024-02-20 09:23:23
品牌 Logo 应用领域
超微 - AMD 可编程只读存储器电动程控只读存储器
页数 文件大小 规格书
12页 162K
描述
512 Kilobit (64 K x 8-Bit) CMOS EPROM

AM27C512-70DE 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:DIP包装说明:DIP, DIP28,.6
针数:28Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.71
风险等级:5.54Is Samacsys:N
最长访问时间:70 nsI/O 类型:COMMON
JESD-30 代码:R-PDIP-T28JESD-609代码:e0
长度:37.084 mm内存密度:524288 bit
内存集成电路类型:OTP ROM内存宽度:8
功能数量:1端子数量:28
字数:65536 words字数代码:64000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:64KX8
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:DIP封装等效代码:DIP28,.6
封装形状:RECTANGULAR封装形式:IN-LINE
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:5 V认证状态:Not Qualified
座面最大高度:5.715 mm最大待机电流:0.0001 A
子类别:OTP ROMs最大压摆率:0.025 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:NO
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:15.24 mm
Base Number Matches:1

AM27C512-70DE 数据手册

 浏览型号AM27C512-70DE的Datasheet PDF文件第3页浏览型号AM27C512-70DE的Datasheet PDF文件第4页浏览型号AM27C512-70DE的Datasheet PDF文件第5页浏览型号AM27C512-70DE的Datasheet PDF文件第7页浏览型号AM27C512-70DE的Datasheet PDF文件第8页浏览型号AM27C512-70DE的Datasheet PDF文件第9页 
mon connection to all devices in the array and  
connected to the READ line from the system control  
bus. This assures that all deselected memory devices  
are in their low-power standby mode and that the out-  
put pins are only active when data is desired from a  
particular memory device.  
these transient current peaks is dependent on the out-  
put capacitance loading of the device. At a minimum, a  
0.1 µF ceramic capacitor (high frequency, low inherent  
inductance) should be used on each device between  
VCC and VSS to minimize transient effects. In addition,  
to overcome the voltage drop caused by the inductive  
effects of the printed circuit board traces on EPROM ar-  
rays, a 4.7 µF bulk electrolytic capacitor should be used  
between VCC and VSS for each eight devices. The loca-  
tion of the capacitor should be close to where the  
power supply is connected to the array.  
System Applications  
During the switch between active and standby condi-  
tions, transient current peaks are produced on the ris-  
ing and falling edges of Chip Enable. The magnitude of  
MODE SELECT TABLE  
Mode  
CE#  
OE#/V  
A0  
X
A9  
X
Outputs  
PP  
Read  
V
V
D
OUT  
IL  
IL  
Output Disable  
Standby (TTL)  
Standby (CMOS)  
Program  
X
V
X
X
High Z  
High Z  
High Z  
IH  
V
X
X
X
IH  
V
± 0.3 V  
X
X
X
CC  
V
V
V
X
X
D
IN  
IL  
IL  
IH  
PP  
Program Verify  
Program Inhibit  
V
X
X
D
OUT  
IL  
V
V
X
X
High Z  
01h  
PP  
Manufacturer Code  
Device Code  
V
V
V
V
V
V
IL  
IL  
IL  
IL  
IL  
H
H
Autoselect  
(Note 3)  
V
V
91h  
IH  
Notes:  
1. V = 12.0 V ± 0.5 V.  
H
2. X = Either V or V .  
IH  
IL  
3. A1–A8 and A10–15 = V  
IL  
4. See DC Programming Characteristics for V voltage during programming.  
PP  
6
Am27C512  

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