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AM1806BZWT3 PDF预览

AM1806BZWT3

更新时间: 2024-01-13 01:49:53
品牌 Logo 应用领域
德州仪器 - TI 微控制器和处理器外围集成电路微处理器时钟
页数 文件大小 规格书
241页 1437K
描述
AM1806 ARM Microprocessor

AM1806BZWT3 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:BGA包装说明:LFBGA, BGA361,19X19,32
针数:361Reach Compliance Code:compliant
ECCN代码:3A991.A.2HTS代码:8542.31.00.01
风险等级:5.68Is Samacsys:N
地址总线宽度:23位大小:32
边界扫描:YES最大时钟频率:30 MHz
外部数据总线宽度:16格式:FIXED POINT
集成缓存:YESJESD-30 代码:S-PBGA-B361
JESD-609代码:e1长度:16 mm
低功率模式:YES湿度敏感等级:3
端子数量:361最高工作温度:90 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:LFBGA封装等效代码:BGA361,19X19,32
封装形状:SQUARE封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度):260电源:1.2,1.8,3.3 V
认证状态:Not Qualified座面最大高度:1.4 mm
速度:375 MHz子类别:Microprocessors
最大供电电压:1.32 V最小供电电压:1.14 V
标称供电电压:1.2 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:16 mm
uPs/uCs/外围集成电路类型:MICROPROCESSOR, RISCBase Number Matches:1

AM1806BZWT3 数据手册

 浏览型号AM1806BZWT3的Datasheet PDF文件第3页浏览型号AM1806BZWT3的Datasheet PDF文件第4页浏览型号AM1806BZWT3的Datasheet PDF文件第5页浏览型号AM1806BZWT3的Datasheet PDF文件第7页浏览型号AM1806BZWT3的Datasheet PDF文件第8页浏览型号AM1806BZWT3的Datasheet PDF文件第9页 
AM1806  
SPRS658BFEBRUARY 2010REVISED MAY 2010  
www.ti.com  
1
AM1806 ARM Microprocessor ........................ 1  
1.1 Features .............................................. 1  
1.2 Trademarks .......................................... 3  
1.3 Description ........................................... 4  
1.4 Functional Block Diagram ............................ 5  
Revision History ......................................... 7  
Device Overview ........................................ 8  
3.1 Device Characteristics ............................... 8  
3.2 Device Compatibility ................................. 9  
3.3 ARM Subsystem ..................................... 9  
3.4 Memory Map Summary ............................. 12  
3.5 Pin Assignments .................................... 15  
3.6 Pin Multiplexing Control ............................ 18  
3.7 Terminal Functions ................................. 19  
Device Configuration ................................. 56  
4.1 Boot Modes ......................................... 56  
4.2 SYSCFG Module ................................... 56  
6.7 Interrupts ............................................ 75  
6.8 Power and Sleep Controller (PSC) ................. 81  
6.9 EDMA ............................................... 86  
6.10 External Memory Interface A (EMIFA) ............. 92  
6.11 DDR2/mDDR Controller ........................... 102  
6.12 Memory Protection Units .......................... 115  
6.13 MMC / SD / SDIO (MMCSD0, MMCSD1) ......... 118  
6.14 Multichannel Audio Serial Port (McASP) .......... 121  
6.15 Multichannel Buffered Serial Port (McBSP) ....... 130  
6.16 Serial Peripheral Interface Ports (SPI0, SPI1) .... 140  
6.17 Inter-Integrated Circuit Serial Ports (I2C) ......... 163  
6.18 Universal Asynchronous Receiver/Transmitter  
(UART) ............................................ 167  
6.19 Universal Serial Bus OTG Controller (USB0)  
[USB2.0 OTG] ..................................... 169  
6.20 LCD Controller (LCDC) ............................ 176  
6.21 Host-Port Interface (UHPI) ........................ 191  
6.22 Universal Parallel Port (uPP) ...................... 199  
6.23 Video Port Interface (VPIF) ....................... 204  
6.24 Enhanced Capture (eCAP) Peripheral ............ 210  
6.25 Enhanced High-Resolution Pulse-Width Modulator  
(eHRPWM) ........................................ 213  
6.26 Timers ............................................. 218  
6.27 Real Time Clock (RTC) ........................... 220  
6.28 General-Purpose Input/Output (GPIO) ............ 223  
6.29 Programmable Real-Time Unit Subsystem (PRUSS)  
..................................................... 227  
2
3
4
5
4.3 Pullup/Pulldown Resistors .......................... 59  
Device Operating Conditions ....................... 60  
5.1  
Absolute Maximum Ratings Over Operating  
Junction Temperature Range  
(Unless Otherwise Noted) ................................. 60  
5.2 Recommended Operating Conditions .............. 61  
5.3  
Electrical Characteristics Over Recommended  
Ranges of Supply Voltage and Operating Junction  
6.30 Emulation Logic ................................... 230  
Device and Documentation Support ............. 236  
Temperature (Unless Otherwise Noted) ............ 63  
Peripheral Information and Electrical  
7
8
6
Specifications .......................................... 64  
7.1 Device Support .................................... 236  
7.2 Documentation Support ........................... 236  
6.1 Parameter Information .............................. 64  
6.2  
Recommended Clock and Control Signal Transition  
Mechanical Packaging and Orderable  
Behavior ............................................ 65  
6.3 Power Supplies ..................................... 65  
6.4 Reset ............................................... 66  
Information ............................................ 237  
8.1  
Device and Development-Support Tool  
Nomenclature ..................................... 237  
8.2 Thermal Data for ZCE Package ................... 238  
8.3 Thermal Data for ZWT Package .................. 239  
6.5  
Crystal Oscillator or External Clock Input .......... 69  
6.6 Clock PLLs ......................................... 70  
6
Contents  
Copyright © 2010, Texas Instruments Incorporated  
Submit Documentation Feedback  
Product Folder Link(s): AM1806  

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