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AIC111YE

更新时间： 2024-02-15 13:40:14
品牌 Logo 应用领域
德州仪器 - TI 解码器编解码器
页数 文件大小 规格书
30页 228K
描述
IC DESIGN SPECIFICATION 1.3-V microPower DSP/uC VOICE BAND AUDIO CODEC

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AIC111YE 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Obsolete零件包装代码：QFN
包装说明：5 X 5 MM, GREEN, PLASTIC, QFN-32针数：32
Reach Compliance Code：compliantHTS代码：8542.39.00.01
Factory Lead Time：1 week风险等级：5.72
Is Samacsys：N滤波器：YES
JESD-30 代码：X-XUUC-N32功能数量：1
端子数量：32工作模式：SYNCHRONOUS
最高工作温度：70 °C最低工作温度：
封装主体材料：UNSPECIFIED封装代码：DIE
封装形状：UNSPECIFIED封装形式：UNCASED CHIP
峰值回流温度（摄氏度）：NOT SPECIFIED认证状态：Not Qualified
标称供电电压：1.3 V表面贴装：YES
电信集成电路类型：PCM CODEC温度等级：COMMERCIAL
端子形式：NO LEAD端子位置：UPPER
处于峰值回流温度下的最长时间：NOT SPECIFIEDBase Number Matches：1

AIC111YE 数据手册

 浏览型号AIC111YE的Datasheet PDF文件第1页浏览型号AIC111YE的Datasheet PDF文件第3页浏览型号AIC111YE的Datasheet PDF文件第4页浏览型号AIC111YE的Datasheet PDF文件第5页浏览型号AIC111YE的Datasheet PDF文件第6页浏览型号AIC111YE的Datasheet PDF文件第7页 
AIC111  
SLAS382 – JUNE 2003  
www.ti.com  
Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoamduring  
storageor handling to prevent electrostatic damage to the MOS gates.  
The AIC111 comes in a 32-pin QFN 5×5-mm package. A 32-pad solder ball bumped flip chip die that comes in waffle  
packs or tape and reel is in preview and will be available 3rd quarter 2003.  
AVAILABLE OPTIONS  
PART NUMBER  
AIC111RHB  
PACKAGE  
32-pin QFN (5 mm x 5 mm), in tube.  
32-pin QFN (5 mm x 5 mm), tape and reel  
AIC111RHBR  
32-padwaffle scale chip package, bumped die in waffle pack (contact the factory for availability) – Preview,  
AIC111YE  
available 3rd quarter 2003  
32-pad (WSCP) bumped die in tape and reel (contact the factory for availability) – Preview, available 3rd  
AIC111YER  
quarter2003  
ABSOLUTE MAXIMUM RATINGS  
overoperating free-air temperature range unless otherwise noted  
(1)(2)  
UNIT  
Inputvoltage  
AI or DI pins  
–0.3 V to 4 V  
–0.3 V to 4.5 V  
100 mA  
Power supply  
VDD, power pins  
Latch-uptolerance  
JEDEC latch-up (EIA/JEDS78)  
Operating free-air temperature range, T  
0°C to 70°C  
–15°C to 85°C  
220°C to 230°C  
–40°C to 125°C  
65% R.H.  
A
Functionaltemperaturerange  
Reflow temperature range (flip chip)  
Storage temperature range, T  
stg  
Storagehumidity  
(1)  
Stresses beyond those listed under absolutemaximumratings may cause permanent damage to the device. These are stress ratings only, and  
functionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderrecommendedoperatingconditionsisnotimplied.  
Exposureto absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2)  
Specifications are assured operating at maximum device limits for QFN package only, unless otherwise specified.  
ELECTRICAL CHARACTERISTICS  
INPUT/OUTPUT, OPERATING TEMPERATURE AT 25°C  
PARAMETER  
TEST CONDITION  
MIN  
TYP  
MAX  
UNIT  
Digital interface (see Notes 1 and 2)  
BUF_DVDD (see Note 1)  
3.6  
V
V
V
V
V
V
V
V
V
High-level input voltage  
Low-level input voltage  
BUF_DVDD–0.2  
BUF_DVSS+0.2  
BUF_DVDD  
IH  
IL  
High-level output voltage  
Low-level output voltage  
OH  
OL  
BUF_DVSS  
Maximum allowed input voltage (AVIN)  
Input impedance (AVIN) (see Note 3)  
Input capacitance (AVIN)  
Differential  
450 mVpk  
Nominal gain = 50x  
20  
5
kΩ  
pF  
Microphone bias voltage (MIC_VSUP)  
Microphone bias resistor (MIC_BIAS)  
20-µAmaximum  
0.87  
27  
0.94  
0.99  
31  
V
29.1  
kΩ  
Fixed Q  
3/4 HB_VDD  
HB_VDD  
20 or 40  
H-bridgeamplifieroutput  
Outputresistance  
DAC full scale output differential  
V
PP  
Adaptive Q  
Differential, HB – V  
= 1.3 V  
Ω
DD  
(1)  
DVDD, VDD_OSC, and AVDD should be within 50 mV, preferably connected together.  
AVSS1, 2, DVSS, and VSS_OSC should be within 50 mV, preferably connected together.  
Maximum (0.9 V, DVDD –0.5 V) ≤ BUF_DVDD ≤3.6 V  
Driving single-ended: Rin = R × [(1+A)/(2+A)], A = PGAC Gain (linear), R = 20.4 kΩ for A ≥ 4 or 20.4 kΩ × (4/A) for A<4.  
Rin(min) = 17 kΩ (A=4), Rin(max) = 59.89 kΩ (A = 0.89), Rin(nom) = 20 kΩ (A = 50).  
(2)  
(3)  
2
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