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AFL12005DZ/ES PDF预览

AFL12005DZ/ES

更新时间: 2024-01-08 05:12:13
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
11页 183K
描述
DC-DC Regulated Power Supply Module, 2 Output, 80W, Hybrid, 0.380 INCH, LOW PROFILE, SEAM WELDED PACKAGE-12

AFL12005DZ/ES 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:0.380 INCH, LOW PROFILE, SEAM WELDED PACKAGE-12Reach Compliance Code:compliant
风险等级:5.18其他特性:ADDITIONAL -5V OUTPUT AVAILABLE
模拟集成电路 - 其他类型:DC-DC REGULATED POWER SUPPLY MODULE最大输入电压:160 V
最小输入电压:80 V标称输入电压:120 V
JESD-30 代码:R-XDMA-P12JESD-609代码:e0
最大负载调整率:1%功能数量:1
输出次数:2端子数量:12
最高工作温度:125 °C最低工作温度:-55 °C
最大输出电流:12.8 A最大输出电压:5.5 V
最小输出电压:4.583 V标称输出电压:5 V
封装主体材料:UNSPECIFIED封装等效代码:MODULE,12LEAD,2.5
封装形状:RECTANGULAR封装形式:MICROELECTRONIC ASSEMBLY
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
子类别:Other Analog ICs表面贴装:NO
技术:HYBRID温度等级:MILITARY
端子面层:TIN LEAD端子形式:PIN/PEG
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
最大总功率输出:80 W微调/可调输出:YES
Base Number Matches:1

AFL12005DZ/ES 数据手册

 浏览型号AFL12005DZ/ES的Datasheet PDF文件第4页浏览型号AFL12005DZ/ES的Datasheet PDF文件第5页浏览型号AFL12005DZ/ES的Datasheet PDF文件第6页浏览型号AFL12005DZ/ES的Datasheet PDF文件第8页浏览型号AFL12005DZ/ES的Datasheet PDF文件第9页浏览型号AFL12005DZ/ES的Datasheet PDF文件第10页 
AFL120XXD Series  
A conservative aid to estimating the total heat sink surface  
When operating in the shared mode, it is important that  
symmetry of connection be maintained as an assurance of area (AHEAT SINK) required to set the maximum case  
optimum load sharing performance. Thus, converter outputs temperature rise (T) above ambient temperature is given  
by the following expression:  
should be connected to the load with equal lengths of wire of  
the same gauge and should be connected to a common  
physical point, preferably at the load along with the converter  
output and return leads. All converters in a paralleled set  
must have their share pins connected together. This  
arrangement is diagrammatically illustrated in Figure III.  
showing the output and return pins connected at a star  
point which is located close as possible to the load.  
1.43  
T  
A
HEAT SINK  
3.0  
0.85  
80P  
where  
T = Case temperature rise above ambient  
As a consequence of the topology utilized in the current  
sharing circuit, the share pin may be used for other functions.  
In applications requiring only a single converter, the voltage  
appearing on the share pin may be used as a “totall current  
monitor”. The share pin open circuit voltage is nominally  
+1.00V at no load and increases linearly with increasing  
total output current to +2.20V at full load. Note that the current  
we refer to here is the total output current, that is, the sum  
of the positive and negative outout currents.  
1
1  
P = Device dissipation in Watts = POUT  
Eff  
As an example, assume that it is desired to operate an  
AFL12015D while holding the case temperature at TC  
+85°C in an area where the ambient temperature is held to  
a constant +25°C; then  
T = 85 - 25 = 60°C  
Thermal Considerations  
Because of the incorporation of many innovative  
technological concepts, the AFL series of converters is  
capable of providing very high output power from a package  
of very small volume. These magnitudes of power density  
can only be obtained by combining high circuit efficiency  
with effective methods of heat removal from the die junctions.  
This requirement has been effectively addressed inside the  
device; but when operating at maximum loads, a significant  
amount of heat will be generated and this heat must be  
conducted away from the case. To maintain the case  
temperature at or below the specified maximum of 125°C,  
this heat must be transferred by conduction to an  
appropriate heat dissipater held in intimate contact with the  
converter base-plate.  
From the Specification Table, the worst case full load  
efficiency for this device is 83% @ 100 watts: thus, power  
dissipation at full load is given by  
1
P = 100•  
1 = 1000.205 = 20.5W  
(
)
.83  
and the required heat sink area is  
1.43  
60  
A
HEAT SINK  
=
3.0 = 56.3 in2  
8020.50.85  
Since the effectiveness of this heat transfer is dependent  
on the intimacy of the baseplate/heatsink interface, it is  
strongly recommended that a high thermal conductivity heat  
transferring medium is inserted between the baseplate and  
heatsink. The material most frequently utilized at the factory  
during all testing and burn-in processes is sold under the  
Thus, a total heat sink surface area (including fins, if any) of  
2
56 in in this example, would limit case rise to 60°C above  
ambient. A flat aluminum plate, 0.25" thick and of approximate  
2
dimension 4" by 7" (28 in per side) would suffice for this  
1
trade name of Sil-Pad® 400 . This particular product is an  
application in a still air environment. Note that to meet the  
criteria in this example, both sides of the plate require  
unrestricted exposure to the +25°C ambient air.  
insulator but electrically conductive versions are also  
available. Use of these materials assures maximum surface  
contact with the heat dissipater thereby compensating for  
any minor surface variations. While other available types of  
heat conductive materials and thermal compounds provide  
similar effectiveness, these alternatives are often less  
convenient and can be somewhat messy to use.  
1
Sil-Pad is a registered Trade Mark of Bergquist, Minneapolis, MN  
www.irf.com  
7

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