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AFE1104E/1KG4 PDF预览

AFE1104E/1KG4

更新时间: 2024-01-19 03:30:17
品牌 Logo 应用领域
德州仪器 - TI 电信光电二极管电信集成电路
页数 文件大小 规格书
14页 467K
描述
DATACOM, DIGITAL SLIC, PDSO48, GREEN, PLASTIC, SSOP-48

AFE1104E/1KG4 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SSOP
包装说明:SSOP, SSOP48,.4针数:48
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.74数据速率:1168 Mbps
JESD-30 代码:R-PDSO-G48JESD-609代码:e4
长度:15.875 mm湿度敏感等级:2
功能数量:1端子数量:48
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:SSOP
封装等效代码:SSOP48,.4封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, SHRINK PITCH峰值回流温度(摄氏度):260
电源:3.3,5 V认证状态:Not Qualified
座面最大高度:2.79 mm子类别:Other Telecom ICs
标称供电电压:3.3 V表面贴装:YES
技术:CMOS电信集成电路类型:DIGITAL SLIC
温度等级:INDUSTRIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.635 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:7.5 mmBase Number Matches:1

AFE1104E/1KG4 数据手册

 浏览型号AFE1104E/1KG4的Datasheet PDF文件第1页浏览型号AFE1104E/1KG4的Datasheet PDF文件第2页浏览型号AFE1104E/1KG4的Datasheet PDF文件第3页浏览型号AFE1104E/1KG4的Datasheet PDF文件第5页浏览型号AFE1104E/1KG4的Datasheet PDF文件第6页浏览型号AFE1104E/1KG4的Datasheet PDF文件第7页 
Not Recommended for New Designs  
PIN CONFIGURATION  
ABSOLUTE MAXIMUM RATINGS  
Analog Inputs: Current .............................................. ±100mA, Momentary  
±10mA, Continuous  
Top View  
SSOP  
Voltage .................................. AGND –0.3V to AVDD +0.3V  
Analog Outputs Short Circuit to Ground (+25°C) ..................... Continuous  
AVDD to AGND ........................................................................ –0.3V to 6V  
PVDD to PGND ........................................................................ –0.3V to 6V  
DVDD to DGND ........................................................................ –0.3V to 6V  
PLLIN or PLLOUT to PGND ......................................... –0.3V to PVDD +0.3V  
Digital Input Voltage to DGND ..................................0.3V to DVDD +0.3V  
Digital Output Voltage to DGND ...............................0.3V to DVDD +0.3V  
AGND, DGND, PGND Differential Voltage ......................................... 0.3V  
Junction Temperature (TJ) ............................................................ +150°C  
Storage Temperature Range .......................................... –40°C to +125°C  
Lead Temperature (soldering, 3s) ................................................. +260°C  
Power Dissipation ......................................................................... 700mW  
PGND  
PVDD  
txCLK  
DGND  
txDAT  
rxD0  
1
2
3
4
5
6
7
8
9
48 PLLIN  
47 PLLOUT  
46 NC  
45 NC  
44 NC  
43 NC  
rxD1  
42 AGND  
41 txLINEP  
40 AVDD  
39 txLINEN  
38 AGND  
37 AVDD  
36 REFN  
35 VCM  
rxD2  
PACKAGE/ORDERING INFORMATION  
rxD3  
PACKAGE  
DRAWING TEMPERATURE  
rxD4 10  
rxD5 11  
PRODUCT  
PACKAGE  
NUMBER(1)  
RANGE  
AFE1104E  
48-Pin Plastic SSOP  
333  
–40°C to +85°C  
DGND 12  
DVDD 13  
rxD6 14  
NOTE: (1) For detailed drawing and dimension table, please see end of data  
sheet, or Appendix C of Burr-Brown IC Data Book.  
AFE1104E  
ELECTROSTATIC  
DISCHARGE SENSITIVITY  
This integrated circuit can be damaged by ESD. Burr-Brown  
recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling  
and installation procedures can cause damage.  
rxD7 15  
34 REFP  
33 AGND  
32 AGND  
31 rxLINEP  
30 rxLINEN  
29 rxHYBP  
28 rxHYBN  
27 AVDD  
26 rxLOOP  
25 rxGAIN1  
rxD8 16  
rxD9 17  
rxD10 18  
rxD11 19  
rxD12 20  
rxD13 21  
rxCLK 22  
rxSYNC 23  
rxGAIN0 24  
ESD damage can range from subtle performance degradation  
to complete device failure. Precision integrated circuits may  
be more susceptible to damage because very small parametric  
changes could cause the device not to meet its published  
specifications.  
®
4
AFE1104  

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