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AFCT-5964TGZ PDF预览

AFCT-5964TGZ

更新时间： 2024-02-28 01:08:20
品牌 Logo 应用领域
富士康 - FOXCONN 光纤
页数 文件大小 规格书
15页 179K
描述
Transceiver, 1261nm Min, 1580nm Max, 155Mbps(Tx), 155Mbps(Rx), LC Connector, DIP, Board/panel Mount, ROHS COMPLIANT, DIP-20

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AFCT-5964TGZ 技术参数

是否Rohs认证： 符合生命周期：Active
包装说明：DIPReach Compliance Code：compliant
ECCN代码：5A991.B.5.AHTS代码：8517.62.00.50
风险等级：5.21主体高度：9.8 mm
主体长度或直径：49 mm内置特性：AMPLIFIER
通信标准：ATM, OC-3, SDH, SONET, STM-1连接类型：LC CONNECTOR
数据速率（接收）：155 Mbps数据速率（发送）：155 Mbps
发射极/检测器类型：LASER, MONITOR, PIN PHOTODIODE光纤设备类型：TRANSCEIVER
光纤类型：9/125, MMF, SMF安装特点：BOARD/PANEL MOUNT
最高工作温度：70 °C最低工作温度：
最大工作波长：1580 nm最小工作波长：1261 nm
标称工作波长：1300 nm标称光功率输出：0.07 mW
封装形式：DIP最小回损：14 dB
灵敏度：-38 dBm最大供电电压：3.5 V
最小供电电压：3.1 V标称供电电压：3.3 V
表面贴装：NOBase Number Matches：1

AFCT-5964TGZ 数据手册

 浏览型号AFCT-5964TGZ的Datasheet PDF文件第1页浏览型号AFCT-5964TGZ的Datasheet PDF文件第2页浏览型号AFCT-5964TGZ的Datasheet PDF文件第3页浏览型号AFCT-5964TGZ的Datasheet PDF文件第5页浏览型号AFCT-5964TGZ的Datasheet PDF文件第6页浏览型号AFCT-5964TGZ的Datasheet PDF文件第7页 
Package  
The overall package concept for these devices consists of  
the following basic elements; two optical subassemblies,  
a electrical subassembly and the housing as illustrated in  
the block diagram in Figure3.  
The optical subassemblies are attached to the electrical  
subassembly. These two units are then fitted within the  
outer housing of the transceiver. The housing is then  
encased with a metal EMI protective shield.  
The package outline drawing and pin out are shown in  
Figures 4 and 5. The details of this package outline and  
pin out are compliant with the multisource definition of  
the 2 x 10 DIP. The low profile of the Avago Technologies  
transceiver design complies with the maximum height  
allowed for the LC connector over the entire length of the  
package.  
The electrical subassembly carries the signal pins that exit  
from the bottom of the transceiver. The solder posts are  
designed to provide the mechanical strength required to  
withstand the loads imposed on the transceiver by mating  
with the LC connectored fiber cables. Although they are  
not connected electrically to the transceiver, it is recom-  
mended to connect them to chassis ground.  
The electrical subassembly consists of high volume multi-  
layer printed circuit board on which the IC and various  
surface-mounted passive circuit elements are attached.  
RX SUPPLY  
NOTE  
DATA OUT  
PIN PHOTODIODE  
PREAMPLIFIER  
SUBASSEMBLY  
QUANTIZER IC  
DATA OUT  
RX GROUND  
SIGNAL DETECT  
LC  
TX GROUND  
RECEPTACLE  
DATA IN  
DATA IN  
Tx DISABLE  
LASER BIAS  
MONITORING  
LASER  
OPTICAL  
SUBASSEMBLY  
LASER DRIVER  
AND CONTROL  
CIRCUIT  
LASER DIODE  
MODULATOR  
TX SUPPLY  
CASE  
Note: Nose clip provides connection to chassis ground for both EMI and Thermal Dissipation.  
Figure 3. Block Diagram  
4
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