Datasheet > AFCT-5963TLZ

AFCT-5963TLZ

更新时间： 2022-12-01 20:52:35

品牌	Logo	应用领域
安捷伦 - AGILENT		/
页数	文件大小	规格书
16页	621K
描述
Transceiver, Through Hole Mount,

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AFCT-5963TLZ 数据手册

Package

The overall package concept

for these devices consists of

the following basic elements;

two optical subassemblies, two

electrical subassemblies and

the housing as illustrated in

the block diagram in Figure 3.

The electrical subassemblies

consist of high volume

multilayer printed circuit

boards on which the IC and

various surface-mounted

passive circuit elements are

attached.

The housing is then encased

with a metal EMI protective

shield. The case is connected

to signal ground and we

recommend soldering the four

ground tabs to host card signal

ground.

The package outline drawing

and pin out are shown in

Figures 4 and 5. The details of internal shield for the

this package outline and pin

out are compliant with the

multisource definition of the 2

x 5 DIP. The low profile of the fields.

Agilent transceiver design

complies with the maximum

height allowed for the LC

connector over the entire

length of the package.

The receiver electrical

subassembly includes an

The PCBs for the two electrical

subassemblies both carry the

signal pins that exit from the

bottom of the transceiver. The

solder posts are fastened into

the molding of the device and

are designed to provide the

mechanical strength required

to withstand the loads

imposed on the transceiver by

mating with the LC

connectored fiber cables.

Although they are not

electrical and optical

subassembly to ensure high

immunity to external EMI

The optical subassemblies are

each attached to their

respective transmit or receive

electrical subassemblies. These

two units are then fitted

within the outer housing of the

transceiver that is molded of

filled nonconductive plastic to

provide mechanical strength.

connected electrically to the

transceiver, it is recommended

to connect them to chassis

ground.

R_XSUPPLY

NOTE

DATA OUT

PIN PHOTODIODE

PREAMPLIFIER

SUBASSEMBLY

QUANTIZER IC

R_XGROUND

SIGNAL

DETECT

T_XGROUND

RECEPTACLE

DATA IN

Tx DISABLE

LASER BIAS

MONITORING

LASER

OPTICAL

SUBASSEMBLY

LASER DRIVER

AND CONTROL

CIRCUIT

LASER DIODE

MODULATOR

T_XSUPPLY

CASE

NOTE: NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR BOTH EMI AND THERMAL DISSIPATION.

Figure 3. Block Diagram

1 2 345 6 7...16

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