Datasheet > AFBR-5803AZ

AFBR-5803AZ

更新时间： 2024-01-12 19:46:43

品牌	Logo	应用领域
安捷伦 - AGILENT		光纤异步传输模式以太网 ATM
页数	文件大小	规格书
16页	288K
描述
FDDI, 100 Mb/s ATM, and Fast Ethernet Transceivers in Low Cost 1 x 9 Package Style

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技术参数
数据手册

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AFBR-5803AZ 技术参数

是否Rohs认证：	符合	生命周期：	Active
Reach Compliance Code：	compliant	ECCN代码：	5A991.B.5.A
HTS代码：	8517.62.00.50	风险等级：	1.32
Samacsys Confidence：	4	Samacsys Status：	Released
2D Presentation：	https://componentsearchengine.com/2D/0T/839502.1.1.png	Schematic Symbol：	https://componentsearchengine.com/symbol.php?partID=839502
PCB Footprint：	https://componentsearchengine.com/footprint.php?partID=839502	3D View：	https://componentsearchengine.com/viewer/3D.php?partID=839502
Samacsys PartID：	839502	Samacsys Image：	https://componentsearchengine.com/Images/9/AFBR-5803Z.jpg
Samacsys Thumbnail Image：	https://componentsearchengine.com/Thumbnails/1/AFBR-5803Z.jpg	Samacsys Pin Count：	9
Samacsys Part Category：	Integrated Circuit	Samacsys Package Category：	Other
Samacsys Footprint Name：	AFBR-5803Z-2	Samacsys Released Date：	2019-02-07 11:12:52
Is Samacsys：	N	其他特性：	IT ALSO OPERATES VOLTAGE RANGES FROM 4.75V TO 5.25V, 1X9 ARRAY
主体宽度：	25.4 mm	主体高度：	12 mm
主体长度或直径：	24.8 mm	内置特性：	AMPLIFIER
通信标准：	ATM, OC-3C, SONET	连接类型：	SC CONNECTOR
数据速率（接收）：	125 Mbps	数据速率（发送）：	125 Mbps
发射极/检测器类型：	LASER DIODE, PIN PHOTODIODE	光纤设备类型：	TRANSCEIVER
光纤类型：	50/125, 62.5/125, MMF	JESD-609代码：	e3
安装特点：	THROUGH HOLE MOUNT	最高工作温度：	70 °C
最低工作温度：		最大工作波长：	1380 nm
最小工作波长：	1270 nm	标称工作波长：	1308 nm
标称光功率输出：	0.039 mW	子类别：	Fiber Optic Transceivers
最大供电电压：	3.5 V	最小供电电压：	3.135 V
标称供电电压：	3.3 V	表面贴装：	NO
端子面层：	Tin (Sn)	Base Number Matches：	1

AFBR-5803AZ 数据手册

Transmitter Sections

The package outline drawings

and pin out are shown in

Figures 2, 2a and 3. The

details of this package outline

and pin out are compliant

with the multisource definition provide mechanical strength

of the 1 x 9 SIP. The low

profile of the Agilent

The outer housing including

the duplex SC connector

receptacle or the duplex ST

ports is molded of filled

nonconductive plastic to

The transmitter section of the

AFBR-5803Z and AFBR-5805Z

series utilize 1300 nm Surface

Emitting InGaAsP LEDs. These

LEDs are packaged in the

optical subassembly portion of

the transmitter section. They

are driven by a custom silicon

IC which converts differential

PECL logic signals, ECL

and electrical isolation. The

solder posts of the Agilent

design are isolated from the

circuit design of the

transceiver and do not require

connection to a ground plane

on the circuit board.

transceiver design complies

with the maximum height

allowed for the duplex SC

referenced (shifted) to a +3.3 V connector over the entire

or +5 V supply, into an analog

LED drive current.

length of the package.

The optical subassemblies

utilize a high volume assembly

process together with low cost

lens elements which result in a two solder posts which exit

cost effective building block.

The transceiver is attached to

a printed circuit board with

the nine signal pins and the

Receiver Sections

The receiver sections of the

AFBR-5803Z and AFBR-5805Z

series utilize InGaAs PIN

photodiodes coupled to a

custom silicon transimpedance

preamplifier IC. These are

packaged in the optical sub-

assembly portion of the

receiver.

the bottom of the housing. The

two solder posts provide the

primary mechanical strength to

withstand the loads imposed

on the transceiver by mating

with duplex or simplex SC or

ST connectored fiber cables.

The electrical subassembly

consists of a high volume

multilayer printed circuit

board on which the IC chips

and various surface-mounted

passive circuit elements are

attached.

These PIN/preamplifier combi-

nations are coupled to a

custom quantizer IC which

provides the final pulse

shaping for the logic output

and the Signal Detect function.

The data output is differential.

The signal detect output is

single-ended. Both data and

signal detect outputs are PECL

compatible, ECL referenced

(shifted) to a +3.3 V or +5 V

power supply.

The package includes internal

shields for the electrical and

optical subassemblies to ensure

low EMI emissions and high

immunity to external EMI

fields.

ELECTRICAL SUBASSEMBLY

DUPLEX SC

RECEPTACLE

DIFFERENTIAL

DATA OUT

PIN PHOTODIODE

SINGLE-ENDED

SIGNAL

QUANTIZER IC

DETECT OUT

Package

PREAMP IC

OPTICAL

The overall package concept

for the Agilent transceivers

consists of the following basic

elements; two optical

subassemblies, an electrical

subassembly and the housing

as illustrated in Figure 1 and

Figure 1a.

SUBASSEMBLIES

DIFFERENTIAL

DATA IN

LED

DRIVER IC

TOP VIEW

Figure 1. SC Connector Block Diagram.

123 4 5 6 7...16

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