CC
ꢁT75
-SOLUTECM XIMUMCR TINGSC
Table 4.
Stresses above those listed under Absolute Maꢀimum Ratings
Parameter
Rating
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Eꢀposure to absolute
maꢀimum rating conditions for eꢀtended periods may affect
device reliability.
VDD to GND
–0.3 V to +7 V
SDA Input Voltage to GND
SDA Output Voltage to GND
SCL Input Voltage to GND
OS/ALERT Output Voltage to GND
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature, TJMAX
8-Lead MSOP (RM-8)
–0.3 V to VDD + 0.3 V
–0.3 V to VDD + 0.3 V
–0.3 V to VDD + 0.3 V
–0.3 V to VDD + 0.3 V
–55°C to +150°C
–65°C to +160°C
150.7°C
1.2
1.0
0.8
0.6
0.4
2
Power Dissipation1,
WMAX = (TJMAX − TA)/θJA
Thermal Impedance3
θJA, Junction-to-Ambient (Still Air)
θJC, Junction-to-Case
205.9°C/W
43.74°C/W
8-Lead SOIC (R-8)
Power Dissipation1, 2
Thermal Impedance3
WMAX = (TJMAX − TA)/θJA
0.2
MAX PD = 3.4mW AT 150°C
θJA, Junction-to-Ambient (Still Air)
θJC, Junction-to-Case
157°C/W
56°C/W
0
IR Reflow Soldering
Peak Temperature
TEMPERATURE (°C)
220°C (0°C/5°C)
Figure 3. MSOP Maximum Power Dissipation vs. Ambient Temperature
Time at Peak Temperature
Ramp-Up Rate
Ramp-Down Rate
Time 25°C to Peak Temperature
IR Reflow Soldering (Pb-Free Package)
Peak Temperature
10 sec to 20 sec
3°C/sec maximum
–6°C/sec maximum
6 minutes maximum
260°C (+0°C)
Time at Peak Temperature
Ramp-Up Rate
Ramp-Down Rate
20 sec to 40 sec
3°C/sec maximum
–6°C/sec maximum
8 minutes maximum
Time 25°C to Peak Temperature
1 Values relate to package being used on a standard 2-layer PCB. This gives a
worst case θJA and θJC. Refer to Figure 3 for a plot of maximum power
dissipation vs. ambient temperature (TA).
2 TA = ambient temperature.
3 Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a heat
sink. Junction-to-ambient resistance is more useful for air-cooled, PCB-
mounted components.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degrada-
tion or loss of functionality.
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