ADT75ARM

更新时间： 2024-02-07 06:38:54

品牌	Logo	应用领域
亚德诺 - ADI		传感器温度传感器
页数	文件大小	规格书
24页	389K
描述
+-1∑C Accurate, 12-Bit Digital Temperature Sensor

阅读下载

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

ADT75ARM 数据手册

ꢁT75

-SOLUTECM XIMUMCR TINGSC

Table 4.

Stresses above those listed under Absolute Maꢀimum Ratings

Parameter

Rating

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Eꢀposure to absolute

maꢀimum rating conditions for eꢀtended periods may affect

device reliability.

V_DDto GND

–0.3 V to +7 V

SDA Input Voltage to GND

SDA Output Voltage to GND

SCL Input Voltage to GND

OS/ALERT Output Voltage to GND

Operating Temperature Range

Storage Temperature Range

Maximum Junction Temperature, T_JMAX

8-Lead MSOP (RM-8)

–0.3 V to V_DD+ 0.3 V

–55°C to +150°C

–65°C to +160°C

150.7°C

1.2

1.0

0.8

0.6

0.4

Power Dissipation^1,

W_MAX= (T_JMAX− T_A)/θ_JA

Thermal Impedance³

θ_JA, Junction-to-Ambient (Still Air)

θ_JC, Junction-to-Case

205.9°C/W

43.74°C/W

8-Lead SOIC (R-8)

Power Dissipation^{1, 2}

Thermal Impedance³

W_MAX= (T_JMAX− T_A)/θ_JA

0.2

MAX PD = 3.4mW AT 150°C

θ_JA, Junction-to-Ambient (Still Air)

θ_JC, Junction-to-Case

157°C/W

56°C/W

IR Reflow Soldering

Peak Temperature

TEMPERATURE (°C)

220°C (0°C/5°C)

Figure 3. MSOP Maximum Power Dissipation vs. Ambient Temperature

Time at Peak Temperature

Ramp-Up Rate

Ramp-Down Rate

Time 25°C to Peak Temperature

IR Reflow Soldering (Pb-Free Package)

Peak Temperature

10 sec to 20 sec

3°C/sec maximum

–6°C/sec maximum

6 minutes maximum

260°C (+0°C)

Time at Peak Temperature

Ramp-Up Rate

Ramp-Down Rate

20 sec to 40 sec

3°C/sec maximum

–6°C/sec maximum

8 minutes maximum

Time 25°C to Peak Temperature

¹Values relate to package being used on a standard 2-layer PCB. This gives a

worst case θ_JAand θ_JC. Refer to Figure 3 for a plot of maximum power

dissipation vs. ambient temperature (T_A).

²T_A= ambient temperature.

³Junction-to-case resistance is applicable to components featuring a

preferential flow direction, for example, components mounted on a heat

sink. Junction-to-ambient resistance is more useful for air-cooled, PCB-

mounted components.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on

the human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degrada-

tion or loss of functionality.

Rev. 0 | Page 7 of 24

1...4 5 678 9 10...24

下载PDF

与ADT75ARM相关器件

型号	品牌	描述	获取价格	数据表
ADT75ARM-REEL	ADI	+-1∑C Accurate, 12-Bit Digital Temperature Se	获取价格
ADT75ARM-REEL7	ADI	+-1∑C Accurate, 12-Bit Digital Temperature Se	获取价格
ADT75ARMZ	ADI	+-1∑C Accurate, 12-Bit Digital Temperature Se	获取价格
ADT75ARMZ-REEL	ADI	+-1∑C Accurate, 12-Bit Digital Temperature Se	获取价格
ADT75ARMZ-REEL7	ADI	+-1∑C Accurate, 12-Bit Digital Temperature Se	获取价格
ADT75ARZ	ADI	+-1∑C Accurate, 12-Bit Digital Temperature Se	获取价格

产品中心

服务支持

精选活动

关于我们

帮助中心

ADT75ARM

ADT75ARM 数据手册

与ADT75ARM相关器件

与ADT75ARM相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

ADT75ARM

ADT75ARM 数据手册

与ADT75ARM相关器件

与ADT75ARM相关文章

您还可以找

您在本页遇到什么问题？