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ADT6504ARJP005 PDF预览

ADT6504ARJP005

更新时间: 2024-01-04 18:50:16
品牌 Logo 应用领域
亚德诺 - ADI 开关传感器换能器
页数 文件大小 规格书
16页 259K
描述
Low Cost, 2.7 V to 5.5 V, Micropower Temperature Switches in SOT-23

ADT6504ARJP005 技术参数

是否Rohs认证:不符合生命周期:Obsolete
Reach Compliance Code:unknown风险等级:5.92
Is Samacsys:N安装特点:SURFACE MOUNT
端子数量:5最大工作电流:0.085 mA
最高工作温度:125 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装等效代码:TSOP5/6,.11,37
封装形状/形式:RECTANGULAR电源:3/5 V
子类别:Other Sensors表面贴装:YES
Base Number Matches:1

ADT6504ARJP005 数据手册

 浏览型号ADT6504ARJP005的Datasheet PDF文件第1页浏览型号ADT6504ARJP005的Datasheet PDF文件第2页浏览型号ADT6504ARJP005的Datasheet PDF文件第3页浏览型号ADT6504ARJP005的Datasheet PDF文件第5页浏览型号ADT6504ARJP005的Datasheet PDF文件第6页浏览型号ADT6504ARJP005的Datasheet PDF文件第7页 
ADT6501/ADT6502/ADT6503/ADT6504  
Preliminary Technical Data  
ABSOLUTE MAXIMUM RATINGS  
Table 2.  
Parameter  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Rating  
VCC to GND  
–±.3 V to +7 V  
–±.3 V to VCC + ±.3 V  
–±.3 V to +7 V  
–±.3 V to VDD + ±.3 V  
2± mA  
HYST Input Voltage to GND  
Open Drain Output Voltage to GND  
Push-Pull Output Voltage to GND  
Input Current on All Pins  
Output Current on All Pins  
Operating Temperature Range  
Storage Temperature Range  
Maximum Junction Temperature, TJMAX  
5-Lead SOT-23 (RJ-5)  
Power Dissipation2  
Thermal Impedance4  
θJA, Junction-to-Ambient (still air)  
IR Reflow Soldering (Pb-Free Package)  
Peak Temperature  
Time at Peak Temperature  
Ramp-Up Rate  
2± mA  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
–55°C to +125°C  
–65°C to +16±°C  
15±.7°C  
3
WMAX = (TJMAX − TA )/θJA  
24±°C/W  
26±°C (+±°C)  
2± sec to 4± sec  
3°C/sec maximum  
–6°C/sec maximum  
8 minutes maximum  
0.1  
SOT-23 PD @ 125°C = 0.107W  
0
Ramp-Down Rate  
Time 25°C to Peak Temperature  
–55 –40 –20  
0
20  
40  
60  
80  
100 120  
–50 –30 –10  
10  
30  
50  
70  
90 110 125  
TEMPERATURE (°C)  
1 Values relate to package being used on a standard 2-layer PCB. This gives a  
worst case θJA. Refer to Figure 2 for a plot of maximum power dissipation vs.  
ambient temperature (TA).  
Figure 2. SOT-23 Maximum Power Dissipation vs. Temperature  
2 TA = ambient temperature.  
3 Junction-to-case resistance is applicable to components featuring a  
preferential flow direction, for example, components mounted on a heat  
sink. Junction-to-ambient resistance is more useful for air-cooled, PCB-  
mounted components  
ESD CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4±±± V readily accumulate on  
the human body and test equipment and can discharge without detection. Although this product features  
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy  
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance  
degradation or loss of functionality.  
Rev. PrA | Page 4 of 16  
 
 

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