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ADP8866ACPZ-R7 PDF预览

ADP8866ACPZ-R7

更新时间: 2024-02-29 03:24:02
品牌 Logo 应用领域
亚德诺 - ADI PC驱动接口集成电路
页数 文件大小 规格书
53页 1174K
描述
Charge Pump Driven 9-Channel LED Driver with Automated LED Lighting Effects

ADP8866ACPZ-R7 技术参数

Source Url Status Check Date:2013-05-01 14:56:47.183是否无铅:含铅
是否Rohs认证:符合生命周期:Active
零件包装代码:QFN包装说明:LFCSP-20
针数:20Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:1.68Samacsys Confidence:
Samacsys Status:ReleasedSchematic Symbol:https://componentsearchengine.com/symbol.php?partID=287514
PCB Footprint:https://componentsearchengine.com/footprint.php?partID=287514Samacsys PartID:287514
Samacsys Image:https://componentsearchengine.com/Images/9/ADP8866ACPZ-R7.jpgSamacsys Thumbnail Image:https://componentsearchengine.com/Thumbnails/1/ADP8866ACPZ-R7.jpg
Samacsys Pin Count:21Samacsys Part Category:Integrated Circuit
Samacsys Package Category:OtherSamacsys Footprint Name:QFN50P400X400X80-21N
Samacsys Released Date:2017-01-10 13:33:33Is Samacsys:N
数据输入模式:SERIAL接口集成电路类型:LED DISPLAY DRIVER
JESD-30 代码:S-XQCC-N20JESD-609代码:e3
长度:4 mm湿度敏感等级:3
复用显示功能:NO功能数量:1
区段数:9端子数量:20
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装代码:HVQCCN
封装等效代码:LCC20,.16SQ,20封装形状:SQUARE
封装形式:CHIP CARRIER峰值回流温度(摄氏度):260
电源:3.6 V认证状态:Not Qualified
座面最大高度:0.8 mm子类别:Display Drivers
最大供电电压:5.5 V最小供电电压:2.5 V
标称供电电压:3.6 V表面贴装:YES
技术:DMOS温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn)端子形式:NO LEAD
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:30宽度:4 mm
最小 fmax:0.4 MHzBase Number Matches:1

ADP8866ACPZ-R7 数据手册

 浏览型号ADP8866ACPZ-R7的Datasheet PDF文件第3页浏览型号ADP8866ACPZ-R7的Datasheet PDF文件第4页浏览型号ADP8866ACPZ-R7的Datasheet PDF文件第5页浏览型号ADP8866ACPZ-R7的Datasheet PDF文件第7页浏览型号ADP8866ACPZ-R7的Datasheet PDF文件第8页浏览型号ADP8866ACPZ-R7的Datasheet PDF文件第9页 
Data Sheet  
ADP8866  
ABSOLUTE MAXIMUM RATINGS  
THERMAL RESISTANCE  
Table 2.  
The θJA (junction to air) and θJC (junction to case) are  
determined according to JESD51-9 on a 4-layer printed circuit  
board (PCB) with natural convection cooling. The exposed pad  
must be soldered to GND.  
Parameter  
Rating  
VIN, VOUT to GND  
D1, D2, D3, D4, D5, D6, D7, D8, and D9 to  
GND  
nINT, nRST, SCL, and SDA to GND  
Output Short-Circuit Duration  
Operating Ambient Temperature Range  
Operating Junction Temperature Range  
Storage Temperature Range  
Soldering Conditions  
−0.3 V to +6 V  
−0.3 V to +6 V  
−0.3 V to +6 V  
Indefinite  
−40°C to +85°C1  
−40°C to +125°C  
−65°C to +150°C  
JEDEC J-STD-020  
Table 3. Thermal Resistance  
Package Type  
θJA  
θJC  
Unit  
LFCSP  
38.6  
3.56  
°C/W  
ESD CAUTION  
ESD (Electrostatic Discharge)  
Human Body Model (HBM)  
Charged Device Model (CDM)  
2.0 kV  
1.5 kV  
1 The maximum operating junction temperature (TJ(MAX)) supersedes the  
maximum operating ambient temperature (TA(MAX)). See the Maximum  
Temperature Ranges section for more information.  
Stresses at or above those listed under Absolute Maximum  
Ratings may cause permanent damage to the product. This is a  
stress rating only; functional operation of the product at these  
or any other conditions above those indicated in the operational  
section of this specification is not implied. Operation beyond  
the maximum operating conditions for extended periods may  
affect product reliability.  
Absolute maximum ratings apply individually only, not in  
combination. Unless otherwise specified, all voltages are  
referenced to GND.  
MAXIMUM TEMPERATURE RANGES  
The maximum operating junction temperature (TJ(MAX)  
)
supersedes the maximum operating ambient temperature  
(TA(MAX)). Therefore, in situations where the ADP8866 is  
exposed to poor thermal resistance and a high power dissipation  
(PD), the maximum ambient temperature may need to be derated.  
In these cases, the ambient temperature maximum can be  
calculated with the following equation:  
T
A(MAX) = TJ(MAX) − (θJA × PD(MAX)).  
Rev. B | Page 5 of 52  
 
 
 
 

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