Datasheet > ADP2165ACPZ-3.3-R7

ADP2165ACPZ-3.3-R7

更新时间： 2022-05-14 22:16:14

品牌	Logo	应用领域
亚德诺 - ADI		/
页数	文件大小	规格书
23页	670K
描述
5.5 V, 5 A/6 A, High Efficiency, Step-Down DC-to-DC Regulators with Output Tracking

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ADP2165/ADP2166

Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 2.

THERMAL RESISTANCE

θ_JAis specified for the worst-case conditions, that is, a device

soldered in a circuit board (4-layer, JEDEC standard board) for

surface-mount packages.

Parameter

Rating

PVIN, AVIN, EN, PGOOD, FB

−0.3 V to +6 V

−1 V to +6 V

BST

SW + 6 V

Table 3. Thermal Resistance

Package Type

24-Lead LFCSP

SS, COMP, TRK, VREG, SYNC, RT

PGND to GND

Operating Junction Temperature Range

Storage Temperature Range

Soldering Conditions

−0.3 V to +6 V

−0.3 V to +0.3 V

−40°C to +125°C

−65°C to +150°C

JEDEC J-STD-020

θ_JA

Unit

38.3

°C/W

ESD CAUTION

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

Rev. B | Page 6 of 23

1...3 4 567 8 9...23

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