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ADP2108AUJZ-3.3-R7 PDF预览

ADP2108AUJZ-3.3-R7

更新时间: 2024-02-06 11:57:57
品牌 Logo 应用领域
亚德诺 - ADI 转换器
页数 文件大小 规格书
20页 1331K
描述
Compact, 600 mA, 3 MHz, Step-Down DC-to-DC Converter

ADP2108AUJZ-3.3-R7 数据手册

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ADP2108  
Data Sheet  
ABSOLUTE MAXIMUM RATINGS  
Table 2.  
Parameter  
VIN, EN  
FB, SW to GND  
Operating Ambient Temperature Range  
Operating Junction Temperature Range  
Storage Temperature Range  
Lead Temperature Range  
Soldering (10 sec)  
In applications with moderate power dissipation and low PCB  
thermal resistance, the maximum ambient temperature can  
exceed the maximum limit as long as the junction temperature  
is within specification limits. The junction temperature (TJ)  
of the device is dependent on the ambient temperature (TA),  
the power dissipation (PD) of the device, and the junction-to-  
ambient thermal resistance of the package (θJA). Maximum  
junction temperature (TJ) is calculated from the ambient  
temperature (TA) and power dissipation (PD) using the formula  
Rating  
−0.4 V to +6.5 V  
−1.0 V to (VIN + 0.2 V)  
−40°C to +125°C  
−40°C to +125°C  
−65°C to +150°C  
−65°C to +150°C  
300°C  
Vapor Phase (60 sec)  
Infrared (15 sec)  
215°C  
TJ = TA + (PD × θJA).  
220°C  
THERMAL RESISTANCE  
ESD Human Body Model  
ESD Charged Device Model  
ESD Machine Model  
1500 V  
θJA is specified for a device mounted on a JEDEC 2S2P PCB.  
500 V  
100 V  
Table 3. Thermal Resistance  
Package Type  
5-Ball WLCSP  
5-Lead TSOT  
θJA  
Unit  
°C/W  
°C/W  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
105  
170  
ESD CAUTION  
Absolute maximum ratings apply individually only, not in  
combination. Unless otherwise specified, all other voltages  
are referenced to GND.  
The ADP2108 can be damaged when the junction temperature  
limits are exceeded. Monitoring ambient temperature does not  
guarantee that TJ is within the specified temperature limits.  
In applications with high power dissipation and poor thermal  
resistance, the maximum ambient temperature may have to  
be derated.  
Rev. G | Page 4 of 20  
 
 
 

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