ADP1882/ADP1883
ABSOLUTE MAXIMUM RATINGS
Table 2.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Parameter
Rating
VDD to GND
−0.3 V to +6 V
VIN to PGND
FB, COMP/EN to GND
DRVL to PGND
SW to PGND
BST to SW
BST to PGND
DRVH to SW
PGND to GND
θJA (10-Lead MSOP)
2-Layer Board
4-Layer Board
−0.3 V to +28 V
−0.3 V to (VDD + 0.3 V)
−0.3 V to (VDD + 0.3 V)
−2.0 V to +28 V
−0.8 V to (VDD + 0.3 V)
−0.3 V to 28 V
Table 3. Thermal Resistance
1
Package Type
θJA (10-Lead MSOP)
2-Layer Board
θJA
Unit
213.1
171.7
°C/W
°C/W
4-Layer Board
−0.3 V to VDD
±0.3 V
1 θJA is specified for the worst-case conditions; that is, θJA is specified for device
soldered in a circuit board for surface-mount packages.
BOUNDARY CONDITION
213.1°C/W
171.7°C/W
In determining the values given in Table 2 and Table 3, natural
convection was used to transfer heat to a 4-layer evaluation board.
Operating Junction Temperature Range −40°C to +125°C
Storage Temperature Range
Soldering Conditions
Maximum Soldering Lead Temperature 300°C
(10 sec)
−65°C to +150°C
JEDEC J-STD-020
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages are
referenced to PGND.
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