Datasheet > ADP1878-1.0-EVALZ

ADP1878-1.0-EVALZ

更新时间： 2022-10-09 10:08:22

品牌	Logo	应用领域
亚德诺 - ADI		控制器
页数	文件大小	规格书
40页	2501K
描述
Synchronous Buck Controller

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ADP1878-1.0-EVALZ 数据手册

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Data Sheet

ADP1878/ADP1879

ABSOLUTE MAXIMUM RATINGS

THERMAL RESISTANCE

Table 2.

Parameter

θ_JAis specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Rating

VREG to PGND, GND

VIN, EN, PGOOD to PGND

FB, COMP, RES, SS to GND

DRVL to PGND

SW to PGND

BST to SW

BST to PGND

DRVH to SW

PGND to GND

−0.3 V to +6 V

−0.3 V to +28 V

−0.3V to (VREG + 0.3 V)

−2.0 V to +28 V

−0.6 V to (VREG + 0.3 V)

−0.3V to +28 V

−0.3 V to VREG

0.3 V

Boundary Condition

In determining the values given in Table 2 and Table 3, natural

convection is used to transfer heat to a 4-layer evaluation board.

Table 3. Thermal Resistance

Package Type

θ_JA

Unit

θ_JA(14-Lead LFCSP_WD)

4-Layer Board

°C/W

PGOOD Input Current

θ_JA(14-Lead LFCSP_WD)

4-Layer Board

35 mA

ESD CAUTION

30°C/W

Operating Junction Temperature Range

Storage Temperature Range

Soldering Conditions

−40°C to +125°C

−65°C to +150°C

JEDEC J-STD-020

Maximum Soldering Lead Temperature 300°C

(10 sec)

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Absolute maximum ratings apply individually only, not in

combination. Unless otherwise specified, all other voltages are

referenced to PGND.

Rev. A | Page 5 of 40

1 2 3 456 7 8...40

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