Datasheet > ADP1870-0.3-EVALZ

ADP1870-0.3-EVALZ

更新时间： 2022-12-26 19:44:17

品牌	Logo	应用领域
亚德诺 - ADI		控制器
页数	文件大小	规格书
44页	1932K
描述
Synchronous Buck Controller with Constant On-Time and Valley Current Mode

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ADP1870/ADP1871

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

THERMAL RESISTANCE

Rating

θ_JAis specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

VREG to PGND, GND

VIN to PGND

FB, COMP/EN to GND

DRVL to PGND

SW to PGND

−0.3 V to +6 V

−0.3 V to +28 V

−0.3 V to (V_REG+ 0.3 V)

−2.0 V to +28 V

−0.6 V to (V_REG+ 0.3 V)

−0.3 V to 28 V

Table 3. Thermal Resistance

Package Type

θ_JA(10-Lead MSOP)

2-Layer Board

θ_JA

Unit

BST to SW

BST to PGND

213.1

171.7

°C/W

4- Layer Board

DRVH to SW

−0.3 V to V_REG

¹θ_JAis specified for the worst-case conditions; that is, θ_JAis specified for the

device soldered in a circuit board for surface-mount packages.

PGND to GND

θ_JA(10-Lead MSOP)

2-Layer Board

4-Layer Board

Operating Junction Temperature

Range

±0.3 V

213.1°C/W

171.7°C/W

−40°C to +125°C

BOUNDARY CONDITION

In determining the values given in Table 2 and Table 3, natural

convection was used to transfer heat to a 4-layer evaluation board.

Storage Temperature Range

Soldering Conditions

Maximum Soldering Lead

Temperature (10 sec)

−65°C to +150°C

JEDEC J-STD-020

300°C

ESD CAUTION

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Absolute maximum ratings apply individually only, not in

combination. Unless otherwise specified, all other voltages are

referenced to PGND.

Rev. 0 | Page 5 of 44

1 2 3 456 7 8...44

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