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ADP160ACBZ-1.8-R7 PDF预览

ADP160ACBZ-1.8-R7

更新时间: 2024-01-10 09:40:56
品牌 Logo 应用领域
亚德诺 - ADI 线性稳压器IC调节器电源电路输出元件PC
页数 文件大小 规格书
20页 500K
描述
Ultralow Quiescent Current, 150 mA, CMOS Linear Regulator

ADP160ACBZ-1.8-R7 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:BGA
包装说明:WLCSP-4针数:4
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:1.45
Samacsys Confidence:Samacsys Status:Released
Schematic Symbol:https://componentsearchengine.com/symbol.php?partID=261752PCB Footprint:https://componentsearchengine.com/footprint.php?partID=261752
Samacsys PartID:261752Samacsys Image:https://componentsearchengine.com/Images/9/ADP160ACBZ-1.8-R7.jpg
Samacsys Thumbnail Image:https://componentsearchengine.com/Thumbnails/1/ADP160ACBZ-1.8-R7.jpgSamacsys Pin Count:4
Samacsys Part Category:Integrated CircuitSamacsys Package Category:Other
Samacsys Footprint Name:BGA4C50P2X2_100X100X64Samacsys Released Date:2017-01-11 11:21:59
Is Samacsys:N可调性:FIXED
最大回动电压 1:0.195 V标称回动电压 1:0.105 V
最大绝对输入电压:6.5 V最大输入电压:5.5 V
最小输入电压:2.2 VJESD-30 代码:S-PBGA-B4
JESD-609代码:e1长度:0.965 mm
最大负载调整率:0.027%湿度敏感等级:1
功能数量:1输出次数:1
端子数量:4工作温度TJ-Max:125 °C
工作温度TJ-Min:-40 °C最高工作温度:125 °C
最低工作温度:-40 °C最大输出电流 1:0.15 A
最大输出电压 1:1.863 V最小输出电压 1:1.737 V
标称输出电压 1:1.8 V封装主体材料:PLASTIC/EPOXY
封装代码:VFBGA封装等效代码:BGA4,2X2,20
封装形状:SQUARE封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH
包装方法:TAPE AND REEL峰值回流温度(摄氏度):260
认证状态:Not Qualified调节器类型:FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
座面最大高度:0.64 mm子类别:Other Regulators
表面贴装:YES技术:CMOS
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:0.5 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:40最大电压容差:3.5%
宽度:0.965 mmBase Number Matches:1

ADP160ACBZ-1.8-R7 数据手册

 浏览型号ADP160ACBZ-1.8-R7的Datasheet PDF文件第2页浏览型号ADP160ACBZ-1.8-R7的Datasheet PDF文件第3页浏览型号ADP160ACBZ-1.8-R7的Datasheet PDF文件第4页浏览型号ADP160ACBZ-1.8-R7的Datasheet PDF文件第6页浏览型号ADP160ACBZ-1.8-R7的Datasheet PDF文件第7页浏览型号ADP160ACBZ-1.8-R7的Datasheet PDF文件第8页 
ADP160/ADP161  
ABSOLUTE MAXIMUM RATINGS  
Table 3.  
Junction-to-ambient thermal resistance (θJA) of the package is  
based on modeling and calculation using a 4-layer board. The  
junction-to-ambient thermal resistance is highly dependent on the  
application and board layout. In applications where high maximum  
power dissipation exists, close attention to thermal board design  
is required. The value of θJA may vary, depending on PCB material,  
layout, and environmental conditions. The specified values of  
θJA are based on a 4-layer, 4 inches × ꢀ inches, circuit board. Refer  
to JESD 51-7 and JESD 51-9 for detailed information on the  
board construction. For additional information, see Application  
Note AN-617, MicroCSP™ Wafer Level Chip Scale Package.  
Parameter  
Rating  
VIN to GND  
VOUT to GND  
−0.3 V to +6.5 V  
−0.3 V to VIN  
EN to GND  
−0.3 V to VIN  
Storage Temperature Range  
Operating Junction Temperature Range  
Operating Ambient Temperature Range  
Soldering Conditions  
−65°C to +150°C  
−40°C to +125°C  
−40°C to +125°C  
JEDEC J-STD-020  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Ψ
JB is the junction to board thermal characterization parameter  
with units of °C/W. ΨJB of the package is based on modeling and  
calculation using a 4-layer board. The JESD51-12, Guidelines for  
Reporting and Using Electronic Package Thermal Information,  
states that thermal characterization parameters are not the same  
as thermal resistances. ΨJB measures the component power flowing  
through multiple thermal paths rather than a single path as in  
thermal resistance, θJB. Therefore, ΨJB thermal paths include  
convection from the top of the package as well as radiation from  
the package, factors that make ΨJB more useful in real-world  
applications. Maximum junction temperature (TJ) is calculated  
from the board temperature (TB) and power dissipation (PD)  
using the formula  
THERMAL DATA  
Absolute maximum ratings only apply individually; they do not  
apply in combination. The ADP160/ADP161 can be damaged  
when the junction temperature limits are exceeded. Monitoring  
ambient temperature does not guarantee that TJ is within the  
specified temperature limits. In applications with high power  
dissipation and poor thermal resistance, the maximum ambient  
temperature may have to be derated.  
TJ = TB + (PD × ΨJB)  
Refer to JESD51-8 and JESD51-12 for more detailed information  
about ΨJB.  
In applications with moderate power dissipation and low PCB  
thermal resistance, the maximum ambient temperature can  
exceed the maximum limit as long as the junction temperature  
is within specification limits. The junction temperature (TJ) of  
the device is dependent on the ambient temperature (TA), the  
power dissipation of the device (PD), and the junction to ambient  
thermal resistance of the package (θJA).  
THERMAL RESISTANCE  
θJA and ΨJB are specified for the worst-case conditions, that is, a  
device soldered in a circuit board for surface-mount packages.  
Table 4. Thermal Resistance  
Package Type  
θJA  
ΨJB  
43  
58  
Unit  
°C/W  
°C/W  
Maximum junction temperature (TJ) is calculated from the ambient  
temperature (TA) and power dissipation (PD) using the formula  
5-Lead TSOT  
4-Ball, 0.4 mm Pitch WLCSP  
170  
260  
TJ = TA + (PD × θJA)  
ESD CAUTION  
Rev. 0 | Page 5 of 20  
 

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