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ADP151AUJZ-2.5-R7 PDF预览

ADP151AUJZ-2.5-R7

更新时间: 2024-02-22 23:13:09
品牌 Logo 应用领域
罗彻斯特 - ROCHESTER 光电二极管
页数 文件大小 规格书
25页 1494K
描述
2.5 V FIXED POSITIVE LDO REGULATOR, 0.23 V DROPOUT, PDSO5, ROHS COMPLIANT, MO-193AB, TSOT-5

ADP151AUJZ-2.5-R7 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:TSOT
包装说明:VSSOP,针数:5
Reach Compliance Code:unknown风险等级:5.66
Is Samacsys:N最大回动电压 1:0.23 V
最大输入电压:5.5 V最小输入电压:2.2 V
JESD-30 代码:R-PDSO-G5JESD-609代码:e3
长度:2.9 mm湿度敏感等级:NOT APPLICABLE
功能数量:1端子数量:5
工作温度TJ-Max:125 °C工作温度TJ-Min:-40 °C
最大输出电流 1:0.2 A最大输出电压 1:2.5375 V
最小输出电压 1:2.4375 V标称输出电压 1:2.5 V
封装主体材料:PLASTIC/EPOXY封装代码:VSSOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):260调节器类型:FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
座面最大高度:1 mm表面贴装:YES
技术:CMOS端子面层:MATTE TIN
端子形式:GULL WING端子节距:0.95 mm
端子位置:DUAL处于峰值回流温度下的最长时间:40
宽度:1.6 mmBase Number Matches:1

ADP151AUJZ-2.5-R7 数据手册

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ADP151  
Data Sheet  
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS  
1
2
VOUT 1  
6 VIN  
1
2
3
5
VIN  
GND  
EN  
VOUT  
ADP151  
TOP VIEW  
(Not to Scale)  
ADP151  
TOP VIEW  
(Not to Scale)  
2
5
NC  
NC  
A
VIN  
VOUT  
TOP VIEW  
(Not to Scale)  
4 EN  
GND 3  
4
NC  
NOTES  
B
EN  
GND  
NC = NO CONNECT  
1. NC = NO CONNECT. DO NOT CONNECT TO THIS PIN.  
2. THE EXPOSED PAD MUST BE CONNECTED TO GROUND.  
Figure 4. 5-Lead TSOT Pin Configuration  
Figure 5. 4-Ball WLCSP Pin Configuration  
Figure 6. 6-Lead LFCSP Pin Configuration  
Table 5. Pin Function Descriptions  
Pin No.  
TSOT  
WLCSP LFCSP  
Mnemonic  
VIN  
GND  
Description  
1
2
3
A1  
B2  
B1  
6
3
4
Regulator Input Supply. Bypass VIN to GND with a 1 µF or greater capacitor.  
Ground.  
Enable Input. Drive EN high to turn on the regulator; drive EN low to turn off the regulator.  
For automatic startup, connect EN to VIN.  
EN  
4
5
N/A  
N/A  
N/A  
A2  
N/A  
N/A  
2
1
5
NC  
VOUT  
NC  
No Connect. Not connected internally.  
Regulated Output Voltage. Bypass VOUT to GND with a 1 µF or greater capacitor.  
No Connect. Not connected internally.  
Exposed Pad. The exposed pad must be connected to ground. The exposed pad enhances  
the thermal performance of the package.  
EPAD  
Rev. E | Page 6 of 24  
 

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