ADP120
ABSOLUTE MAXIMUM RATINGS
Table 3.
Junction-to-ambient thermal resistance (θJA) of the package is
based on modeling and calculation using a four-layer board.
The junction-to-ambient thermal resistance is highly dependent
on the application and board layout. In applications where high
maximum power dissipation exists, close attention to thermal
board design is required. The value of θJA may vary, depending on
PCB material, layout, and environmental conditions. Specified
value of θJA is based on a four-layer, 4 in. × 3 in., 2 1/2 oz.
copper board, as per JEDEC standards. For more information,
see Application Note AN-772, A Design and Manufacturing
Guide for the Lead Frame Chip Scale Package (LFCSP).
Parameter
Rating
VIN to GND
VOUT to GND
−0.3 V to +6 V
−0.3 V to VIN
EN to GND
−0.3 V to +6 V
−65°C to +150°C
−40°C to +125°C
JEDEC J-STD-020
Storage Temperature Range
Operating Junction Temperature Range
Soldering Conditions
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ΨJB is the junction-to-board thermal characterization parameter
with units of °C/W. ΨJB of the package is based on modeling and
calculation using a four-layer board. The JESD51-12, Guidelines
for Reporting and Using Package Thermal Information, states
that thermal characterization parameters are not the same as
thermal resistances. ΨJB measures the component power flowing
through multiple thermal paths rather than a single path as in
thermal resistance, θJB. Therefore, ΨJB thermal paths include
convection from the top of the package as well as radiation from
the package, factors that make ΨJB more useful in real-world
applications. Maximum junction temperature (TJ) is calculated
from the board temperature (TB) and power dissipation (PD)
using the formula
THERMAL DATA
Absolute maximum ratings apply individually only, not in
combination. The ADP120 and ADP120-1 can be damaged
when the junction temperature limits are exceeded. Monitoring
ambient temperature does not guarantee that TJ is within the
specified temperature limits. In applications with high power
dissipation and poor thermal resistance, the maximum ambient
temperature may have to be derated.
TJ = TB + (PD × ΨJB)
In applications with moderate power dissipation and low PCB
thermal resistance, the maximum ambient temperature can
exceed the maximum limit as long as the junction temperature
is within specification limits. The junction temperature (TJ) of
the device is dependent on the ambient temperature (TA), the
power dissipation of the device (PD), and the junction-to-ambient
thermal resistance of the package (θJA).
Refer to JESD51-8 and JESD51-12 for more detailed informa-
tion about ΨJB.
THERMAL RESISTANCE
θJA and ΨJB are specified for the worst-case conditions, that is, a
device soldered in a circuit board for surface-mount packages.
Maximum junction temperature (TJ) is calculated from the
ambient temperature (TA) and power dissipation (PD) using the
formula
Table 4. Thermal Resistance
Package Type
θJA
ΨJB
43
58
Unit
°C/W
°C/W
5-Lead TSOT
4-Ball, 0.4 mm Pitch WLCSP
170
260
TJ = TA + (PD × θJA)
ESD CAUTION
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