PS (ADP4)/PF (ADP1)
NOTES
5. Quality check under actual loading
conditions
To assure reliability, check the sensor
under actual loading conditions. Avoid
any situation that may adversely affect its
performance.
6. Other handling precautions
1) That using the wrong pressure range
or mounting method may result in
accidents.
2) The only direct pressure medium you
can use is dry air. The use of other
media, in particular, corrosive gases
(organic solvent based gases, sulfurous
acid based gases, and hydrogen sulfide
based gases, etc.) and media that
contains moisture or foreign substances
will cause malfunction and damage.
Please do not use them.
3) The pressure sensor chip is positioned
inside the pressure inlet. Never poke
wires or other foreign matter through the
pressure inlet since they may damage
the chip or block the inlet. Avoid use
when the atmospheric pressure inlet is
blocked.
4) Use an operating pressure which is
within the rated pressure range. Using a
pressure beyond this range may cause
damage.
1. Mounting
7) The sensor terminals are designed to
be exposed, so contact of the terminals
with metal shards and the like will cause
output errors. Therefore, please be
careful and prevent things such as metal
shards and hands from contacting the
terminals.
8) To prevent degradation of the PCB
insulation after soldering, please be
careful not to get chemicals on the
sensor when coating.
9) Please consult us regarding the use of
lead-free solder.
3. Cleaning
1) Since the pressure sensor chip is
exposed to the atmosphere, do not allow
cleaning fluid to enter inside.
2) Avoid ultrasonic cleaning since this
may cause breaks or disconnections in
the wiring.
Use lands on the PC boards to which the
sensor can be securely fixed.
2. Soldering
Due to its small size, the thermal capacity
of the pressure sensor DIP type is low.
Therefore, take steps to minimize the
effects of external heat.
Damage and changes to characteristics
may occur due to heat deformation.
Use a non-corrosive resin type of flux.
Since the pressure sensor DIP type is
exposed to the atmosphere, do not allow
flux to enter inside.
1) Manual soldering
• Set the soldering tip from 260 to 300°C
500 to 572°F (30W), and solder for no
more than 5 seconds.
• Please note that output may change if
the pressure is applied on the terminals
when the soldering.
• Thoroughly clean the soldering iron.
2) DIP soldering (DIP terminal type)
• Please keep the DIP solder bath
temperature no higher than 260°C 500°F.
When soldering, heat should be applied
no longer than five seconds.
• When mounting onto a PCB of low
thermal capacity, please avoid DIP
soldering as this may cause heat
deformity.
4. Environment
1) Please avoid using or storing the
pressure sensor chip in a place exposed
to corrosive gases (such as the gases
given off by organic solvents, sulfurous
acid gas, hydrogen sulfides, etc.) which
will adversely affect the performance of
the pressure sensor chip.
2) Since this pressure sensor chip does
not have a water-proof construction,
please do not use the sensor in a location
where it may be sprayed with water, etc.
3) Avoid using the pressure sensors chip
in an environment where condensation
may form.
Furthermore, its output may fluctuate if
any moisture adhering to it freezes.
4) The pressure sensor chip is
constructed in such a way that its output
will fluctuate when it is exposed to light.
Especially when pressure is to be applied
by means of a transparent tube, take
steps to prevent the pressure sensor chip
from being exposed to light.
5) Since static charge can damage the
pressure sensor chip, bear in mind the
following handling precautions.
3) Solder reworking
• Finish reworking in one operation.
• For reworking of the solder bridge, use
a soldering iron with a flat tip. Please do
not add more flux when reworking.
• Please use a soldering iron that is
below the temperature given in the
specifications in order to maintain the
correct temperature at the tip of the
soldering iron.
4) Too much force on the terminals will
cause deformation and loss in
effectiveness of the solder. Therefore,
please avoid dropping and careless
handling of the product.
(1) When storing the pressure sensor
chips, use a conductive material to short
the pins or wrap the entire chip in
aluminum foil. Plastic containers should
not be used to store or transport the
chips since they readily become charged.
(2) When using the pressure sensor
chips, all the charged articles on the
bench surface and the work personnel
should be grounded so that any ambient
static will be safely discharged.
6) Based on the pressure involved, give
due consideration to the securing of the
pressure sensor DIP type and to the
securing and selection of the inlet tube.
Consult us if you have any queries.
5) Avoid using the pressure sensor chip
where it will be susceptible to ultrasonic
or other high-frequency vibration.
5) Please control warping of the PCB
within 0.05 mm of the sensor width.
6) When cut folding the PCB after
mounting the sensor, take measures to
prevent stress to the soldered parts.
ASCTB86E 201407-T1
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