ADN2849

更新时间： 2024-02-13 14:50:53

品牌	Logo	应用领域
亚德诺 - ADI		驱动器
页数	文件大小	规格书
17页	1043K
描述
10.7 Gbps Electro-Absorption Modulator Driver

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技术参数
数据手册

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ADN2849 技术参数

是否Rohs认证：	不符合	生命周期：	Obsolete
零件包装代码：	DIE	包装说明：	2.05 X 2.05 MM, DIE-27
针数：	27	Reach Compliance Code：	compliant
风险等级：	5.92	接口集成电路类型：	INTERFACE CIRCUIT
JESD-30 代码：	S-XUUC-N27	标称负供电电压：	-5.2 V
功能数量：	1	端子数量：	27
最高工作温度：	85 °C	最低工作温度：	-40 °C
封装主体材料：	UNSPECIFIED	封装代码：	DIE
封装形状：	SQUARE	封装形式：	UNCASED CHIP
峰值回流温度（摄氏度）：	NOT SPECIFIED	认证状态：	Not Qualified
表面贴装：	YES	温度等级：	INDUSTRIAL
端子形式：	NO LEAD	端子位置：	UPPER
处于峰值回流温度下的最长时间：	NOT SPECIFIED

ADN2849 数据手册

Preliminary Technical Data

ADN2849

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Min Max Units Conditions

VEE to GND

VBB to GND

TBD TBD

DATAP, DATAN to GND

CLKP, CLKN to GND

CPAP, CPAN to GND

MOD_SET to GND

BIAS_SET to GND

MOD_ENB to GND

CLK_SELB to GND

Staorage temperature range -60

+150 ⁰C

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only;

functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is

not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability

PACKAGE THERMAL SPECIFICATIONS

Table 3.

PARAMETER

θ_J-TOP

θ_J-PAD

MIN

TBD

TYP

TBD

MAX

TBD

UNITS

⁰C/W

CONDITIONS/COMMENTS

Thermal resistance from junction to top of package

Thermal resistance from junction to bottom of exposed pad

ORDERING GUIDE

Table 4.

Model

Temperature range

-40⁰C to +85⁰C

Package description

24 Lead LFCSP

Bare die

ADN2849ACP

ADN2849ACP-RL

ADN2849ACP-RL7

ADN2849SURF

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although

this product features proprietary ESD protection circuitry, permanent damage may occur on devices

subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are

recommended to avoid performance degradation or loss of functionality.

Rev. Pr. G | Page 4 of 17

1 2 345 6 7...17

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