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ADN2841ACPZ-32-RL PDF预览

ADN2841ACPZ-32-RL

更新时间: 2024-02-07 03:23:13
品牌 Logo 应用领域
亚德诺 - ADI 接口集成电路
页数 文件大小 规格书
17页 504K
描述
Dual-Loop, 50 Mbps to 2.7 Gbps Laser Diode Driver

ADN2841ACPZ-32-RL 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:QFN
包装说明:HVQCCN, LCC32,.2SQ,20针数:32
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.08
接口集成电路类型:INTERFACE CIRCUITJESD-30 代码:S-XQCC-N32
JESD-609代码:e3长度:5 mm
湿度敏感等级:3功能数量:1
端子数量:32最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:UNSPECIFIED
封装代码:HVQCCN封装等效代码:LCC32,.2SQ,20
封装形状:SQUARE封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度):260电源:5 V
认证状态:Not Qualified座面最大高度:1 mm
子类别:Display Drivers最大供电电压:5.5 V
最小供电电压:4.5 V标称供电电压:5 V
表面贴装:YES温度等级:INDUSTRIAL
端子面层:MATTE TIN端子形式:NO LEAD
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:40宽度:5 mm
Base Number Matches:1

ADN2841ACPZ-32-RL 数据手册

 浏览型号ADN2841ACPZ-32-RL的Datasheet PDF文件第4页浏览型号ADN2841ACPZ-32-RL的Datasheet PDF文件第5页浏览型号ADN2841ACPZ-32-RL的Datasheet PDF文件第6页浏览型号ADN2841ACPZ-32-RL的Datasheet PDF文件第8页浏览型号ADN2841ACPZ-32-RL的Datasheet PDF文件第9页浏览型号ADN2841ACPZ-32-RL的Datasheet PDF文件第10页 
ADN2841  
Data Sheet  
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS  
PIN 1  
INDICATOR  
PIN 1  
INDICATOR  
GND  
LBWSET  
ASET  
ERSET  
PSET  
GND  
IMPD  
IMPDMON  
IMPDMON2  
1
2
3
4
5
6
7
8
9
36 GND2  
35 IDTONE  
34 GND2  
33 IBMON  
32 IMMON  
31 GND3  
30 VCC3  
29 ALS  
28 FAIL  
27 DEGRADE  
26 CLKSEL  
25 GND  
IBMON  
IMMON  
GND3  
LBWSET  
ASET  
ERSET  
PSET  
IMPD  
IMPDMON  
GND4  
1
24  
23  
2
3
4
5
6
7
8
22  
ADN2841  
ADN2841  
TOP VIEW  
(Not to Scale)  
21 VCC3  
20  
TOP VIEW  
ALS  
19 FAIL  
(Not to Scale)  
18  
17  
DEGRADE  
CLKSEL  
IMPD2 10  
GND4 11  
VCC4 12  
VCC4  
NOTES  
1. THE EXPOSED PAD ON THE BOTTOM OF THE PACKAGE  
MUST BE CONNECTED TO VCC OR THE GND PLANE.  
NOTES  
1. THE EXPOSED PAD ON THE BOTTOM OF THE PACKAGE  
MUST BE CONNECTED TO VCC OR THE GND PLANE.  
Figure 3. Pin Configuration, 48-Lead LFCSP  
Figure 4. Pin Configuration, 32-Lead LFCSP  
Table 4. Pin Function Descriptions  
Pin No.  
48-Lead  
LFCSP  
32-Lead  
LFCSP  
Mnemonic  
GND  
Description  
1
Supply Ground.  
2
3
4
5
1
2
3
4
LBWSET  
ASET  
ERSET  
PSET  
Select Low Loop Bandwidth (Active = VCC).  
Alarm Current Threshold Set Pin.  
Extinction Ratio Set Pin.  
Average Optical Power Set Pin.  
Ground.  
6
GND  
7
8
9
5
6
IMPD  
Monitor Photodiode Input.  
IMPDMON  
IMPDMON2  
IMPD2  
GND4  
VCC4  
ERCAP  
PAVCAP  
GND  
Mirrored Current from Monitor Photodiode.  
Mirrored Current from Monitor Photodiode 2. For use with two MPDs.  
Monitor Photodiode Input 2. For use with two MPDs.  
Supply Ground.  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
7
8
9
10  
Supply Voltage.  
Extinction Ratio Loop Capacitor.  
Average Power Loop Capacitor.  
Ground.  
Supply Voltage.  
Supply Ground.  
Data, Negative Differential Terminal.  
Data, Positive Differential Terminal.  
Supply Ground.  
Data Clock, Positive Differential Terminal. Used if CLKSEL = VCC.  
Data Clock, Negative Differential Terminal. Used if CLKSEL = VCC.  
Ground.  
11  
VCC1  
GND1  
DATAN  
DATAP  
GND1  
CLKP  
CLKN  
GND  
GND  
GND  
12  
13  
14  
15  
16  
Ground.  
Ground.  
17  
18  
CLKSEL  
DEGRADE  
Clock Select (Active = VCC). Used if data is clocked into the chip.  
Degrade Alarm Output.  
Rev. C | Page 6 of 16  
 

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