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ADM7170ACPZ-R7 PDF预览

ADM7170ACPZ-R7

更新时间： 2024-02-29 21:19:18
品牌 Logo 应用领域
亚德诺 - ADI 光电二极管输出元件调节器
页数 文件大小 规格书
24页 1026K
描述
Adjustable and fixed output voltage options

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ADM7170ACPZ-R7 技术参数

是否无铅： 含铅是否Rohs认证： 符合
生命周期：Active包装说明：HVSON,
针数：8Reach Compliance Code：compliant
风险等级：1.65JESD-30 代码：S-PDSO-N8
JESD-609代码：e3长度：3 mm
湿度敏感等级：3功能数量：1
端子数量：8工作温度TJ-Max：125 °C
工作温度TJ-Min：-40 °C最大输出电流 1：0.5 A
最大输出电压 1：6.5 V最小输出电压 1：1.2 V
封装主体材料：PLASTIC/EPOXY封装代码：HVSON
封装形状：SQUARE封装形式：SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度（摄氏度）：260调节器类型：ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR
座面最大高度：0.8 mm表面贴装：YES
技术：CMOS端子面层：Matte Tin (Sn)
端子形式：NO LEAD端子节距：0.5 mm
端子位置：DUAL处于峰值回流温度下的最长时间：30
宽度：3 mmBase Number Matches：1

ADM7170ACPZ-R7 数据手册

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Data Sheet  
ADM7170  
ABSOLUTE MAXIMUM RATINGS  
Table 4.  
maximum power dissipation exists, close attention to thermal  
board design is required. The value of θJA may vary, depending on  
PCB material, layout, and environmental conditions. The  
specified values of θJA are based on a 4-layer, 4 in. × 3 in. circuit  
board. See JESD51-7 and JESD51-9 for detailed information on  
the board construction. For additional information, see the  
AN-617 Application Note, Wafer Level Chip Scale Package,  
available at www.analog.com.  
Parameter  
Rating  
VIN to GND  
VOUT to GND  
−0.3 V to +7 V  
−0.3 V to VIN  
EN to GND  
SS to GND  
−0.3 V to +7 V  
−0.3 V to VIN  
SENSE to GND  
−0.3 V to +7 V  
−65°C to +150°C  
−40°C to +125°C  
JEDEC J-STD-020  
Storage Temperature Range  
Operating Junction Temperature Range  
Soldering Conditions  
ΨJB is the junction-to-board thermal characterization parameter  
with units of °C/W. ΨJB of the package is based on modeling and  
calculation using a 4-layer board. The JESD51-12, Guidelines for  
Reporting and Using Electronic Package Thermal Information,  
states that thermal characterization parameters are not the same  
as thermal resistances. ΨJB measures the component power  
flowing through multiple thermal paths rather than a single  
path as in thermal resistance, θJB. Therefore, ΨJB thermal paths  
include convection from the top of the package as well as  
radiation from the package, factors that make ΨJB more useful  
in real-world applications. Maximum junction temperature (TJ)  
is calculated from the board temperature (TB) and power  
dissipation (PD) using the formula  
Stresses at or above those listed under Absolute Maximum  
Ratings may cause permanent damage to the product. This is a  
stress rating only; functional operation of the product at these  
or any other conditions above those indicated in the operational  
section of this specification is not implied. Operation beyond  
the maximum operating conditions for extended periods may  
affect product reliability.  
THERMAL DATA  
Absolute maximum ratings apply individually only, not in  
combination. The ADM7170 can be damaged when the  
junction temperature limits are exceeded. Monitoring ambient  
temperature does not guarantee that TJ is within the specified  
temperature limits. In applications with high power dissipation  
and poor thermal resistance, the maximum ambient  
temperature may need to be derated.  
TJ = TB + (PD × ΨJB)  
See JESD51-8 and JESD51-12 for more detailed information  
about ΨJB.  
THERMAL RESISTANCE  
θJA, θJC, and ΨJB are specified for the worst-case conditions, that  
is, a device soldered in a circuit board for surface-mount  
packages.  
In applications with moderate power dissipation and low  
printed circuit board (PCB) thermal resistance, the maximum  
ambient temperature can exceed the maximum limit provided  
that the junction temperature is within specification limits. The  
junction temperature (TJ) of the device is dependent on the  
ambient temperature (TA), the power dissipation of the device  
(PD), and the junction-to-ambient thermal resistance of the  
package (θJA).  
Table 5. Thermal Resistance  
Package Type  
θJA  
θJC  
ΨJB  
Unit  
8-Lead LFCSP  
36.4  
23.5  
13.3  
°C/W  
ESD CAUTION  
Maximum junction temperature (TJ) is calculated from the  
ambient temperature (TA) and power dissipation (PD) using the  
formula  
TJ = TA + (PD × θJA)  
Junction-to-ambient thermal resistance (θJA) of the package is  
based on modeling and calculation using a 4-layer board. The  
junction-to-ambient thermal resistance is highly dependent on  
the application and board layout. In applications where high  
Rev. C | Page 5 of 23  
 
 
 
 
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