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ADL5360XCPZ-WP PDF预览

ADL5360XCPZ-WP

更新时间: 2024-02-20 22:51:10
品牌 Logo 应用领域
亚德诺 - ADI 放大器
页数 文件大小 规格书
9页 479K
描述
Dual 900MHz Balanced Mixer with Low Side LO Buffer, IF Amp, and RF Balun

ADL5360XCPZ-WP 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:QFN包装说明:6 X 6 MM, LFCSP-36
针数:36Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.84
JESD-30 代码:S-XQCC-N36长度:6 mm
功能数量:1端子数量:36
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装代码:HVQCCN
封装形状:SQUARE封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
认证状态:Not Qualified座面最大高度:1 mm
标称供电电压:3.3 V表面贴装:YES
技术:BICMOS电信集成电路类型:RF FRONT END CIRCUIT
温度等级:INDUSTRIAL端子形式:NO LEAD
端子节距:0.5 mm端子位置:QUAD
宽度:6 mmBase Number Matches:1

ADL5360XCPZ-WP 数据手册

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Preliminary Technical Data  
OUTLINE DIMENSIONS  
ADL5360  
Figure 10. 36-Lead Lead Frame Chip Scale Package [LFCSP_VQ]  
6mm × 6 mm Body, Very Thin Quad (CP-36-1))  
Dimensions shown in millimeters  
ORDERING GUIDE  
Temperature  
Package  
Option  
Transport  
Branding Media Quantity  
Models  
Range  
Package Description  
ADL5360XCPZ-R7  
−40°C to +85°C 36-Lead Lead Frame Chip Scale Package  
[LFCSP_VQ]  
CP-36-1  
TBD  
TBD, Reel  
ADL5360XCPZ-WP  
ADL5360-EVALZ  
−40°C to +85°C 36-Lead Lead Frame Chip Scale Package  
[LFCSP_VQ]  
CP-36-1  
TBD  
TBD, Waffle Pack  
1
Evaluation Board  
REV. PrA | Page 9 of 9  
PR07884-0-10/08(PrA)  

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