14-Channel, High-Voltage Data-
Acquisition Systems
ADES1754/ADES1755/ADES1756
Absolute Maximum Ratings
HV to AGND........................................................ -0.3V to +80V
RXLP, RXLN, RXUP, RXUN, ALERTIN to AGND-30V to +30V
TXLP, TXLN, ALERTOUT to GNDL2 ....................-0.3V to +6V
TXUP, TXUN to GNDL3 ........................................-0.3V to +6V
DCIN, SWn, V
72)V
, Cn to AGND -0.3V to min (V
BLK
+ 0.3 or
HV
Cn to Cn-1............................................................ -72V to +72V
SWn to SWn-1 .................................................... -0.3V to +52V
CPP to AGND.....................................V
– 1V to V + 1V
HV
DCIN
CPN to AGND........................................ -0.3V to V
+ 0.3V
DCIN
V
V
V
V
to AGND ..................................................... -0.3V to +2.2V
AA
Maximum Continuous Current into Any Pin (Note 1) -50mA to
+50mA
to GNDL1................................................ -0.3V to +2.2V
DDL1
Maximum Continuous Current into SWn Pin (Note 2).. -650mA
to +650mA
to V
..................................................... -0.3V to +0.3V
to GNDL2, GNDL3....................... -0.3V to 6.0V
AA
DDL1
, V
DDL2 DDL3
Maximum Average Power for ESD Diodes (Note 3) 14.4W / √t
Package Continuous Power (Note 4)......................... 2000mW
Operating Temperature Range....................... -40°C to +105°C
Storage Temperature Range.......................... -55°C to +150°C
Junction Temperature (Continuous)..............................+150°C
Soldering Lead Temperature (10s maximum)...............+300°C
AGND to GNDL1, GNDL2, GNDL3...................... -0.3V to 0.3V
AGND to AUXGND ...........................................................-0.3V
GPIOn/AUXINn ......................................-0.3V to V
+ 0.3V
DDL2
THRM to AGND .........................................-0.3V to V + 0.3V
AA
SHDNL to AGND....................................-0.3V to V
+ 0.3V
DCIN
Note 1: Balancing switches disabled.
Note 2: One balancing switch enabled, 60s (max).
Note 3: Average power for time period t where t is the time constant (in µs) of the transient diode current during hot-plug event. For,
example, if t is 330µs, the maximum average power is 0.793W. Peak current must never exceed 2A. Actual average power
during hot-plug must be calculated from the diode current waveform for the application circuit and compared to the
maximum rating.
Multilayer board. For T > +70°C, derate 25mW/°C.
Note 4:
A
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or
any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Information
LQFP
Package Code
C64+13C
21-0083
90-0141
Outline Number
Land Pattern Number
Thermal Resistance, Four Layer Board:
Junction to Ambient (θ
)
JA
40°C/W
8°C/W
Junction to Case (θ
)
JC
For the latest package outline information and land patterns (footprints), go to the Package Index on the Analog Devices website.
Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character,
but the drawing pertains to the package regardless of RoHS status.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.
For detailed information on package thermal considerations, refer to Thermal Characterization of IC Packages.
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