ADC104S101CIMM

更新时间： 2024-02-13 19:35:09

品牌	Logo	应用领域
德州仪器 - TI		转换器
页数	文件大小	规格书
27页	1370K
描述
ADC104S101 4 Channel, 500 ksps to 1 Msps, 10-Bit A/D Converter

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技术参数
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ADC104S101CIMM 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
零件包装代码：	SSOP	包装说明：	GREEN, PLASTIC, VSSOP-10
针数：	10	Reach Compliance Code：	compliant
ECCN代码：	EAR99	HTS代码：	8542.39.00.01
Factory Lead Time：	6 weeks	风险等级：	5.35
Is Samacsys：	N	最大模拟输入电压：	5.25 V
最小模拟输入电压：		最长转换时间：	1.625 µs
转换器类型：	ADC, SUCCESSIVE APPROXIMATION	JESD-30 代码：	S-PDSO-G10
JESD-609代码：	e3	长度：	3 mm
最大线性误差 (EL)：	0.0684%	湿度敏感等级：	1
模拟输入通道数量：	4	位数：	10
功能数量：	1	端子数量：	10
最高工作温度：	85 °C	最低工作温度：	-40 °C
输出位码：	BINARY	输出格式：	SERIAL
封装主体材料：	PLASTIC/EPOXY	封装代码：	TSSOP
封装等效代码：	TSSOP10,.19,20	封装形状：	SQUARE
封装形式：	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	峰值回流温度（摄氏度）：	260
电源：	3/5 V	认证状态：	Not Qualified
采样速率：	1 MHz	采样并保持/跟踪并保持：	TRACK
座面最大高度：	1.1 mm	子类别：	Analog to Digital Converters
标称供电电压：	3 V	表面贴装：	YES
技术：	CMOS	温度等级：	INDUSTRIAL
端子面层：	Matte Tin (Sn)	端子形式：	GULL WING
端子节距：	0.5 mm	端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED	宽度：	3 mm
Base Number Matches：	1

ADC104S101CIMM 数据手册

ADC104S101

www.ti.com

SNAS284F –FEBRUARY 2005–REVISED MARCH 2013

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings^(1)(2)(3)

Supply Voltage V_A

−0.3V to 6.5V

−0.3V to V_A+0.3V

±10 mA

Voltage on Any Pin to GND

Input Current at Any Pin⁽⁴⁾

Package Input Current⁽⁴⁾

Power Consumption at T_A= 25°C

±20 mA

See⁽⁵⁾

Human Body Model

Machine Model

2500V

ESD Susceptibility⁽⁶⁾

250V

Junction Temperature

Storage Temperature

+150°C

−65°C to +150°C

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the

Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may

degrade when the device is not operated under the listed test conditions.

(2) All voltages are measured with respect to GND = 0V, unless otherwise specified.

(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4) When the input voltage at any pin exceeds the power supply (that is, V_IN< GND or V_IN> V_A), the current at that pin should be limited to

10 mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an

input current of 10 mA to two. The Absolute Maximum Rating specification does not apply to the V_Apin. The current into the V_Apin is

limited by the Analog Supply Voltage specification.

(5) The absolute maximum junction temperature (T_Jmax) for this device is 150°C. The maximum allowable power dissipation is dictated by

T_Jmax, the junction-to-ambient thermal resistance (θ_JA), and the ambient temperature (T_A), and can be calculated using the formula

P_DMAX = (T_Jmax − T_A)/θ_JA. The values for maximum power dissipation listed above will be reached only when the device is operated in

a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is

reversed). Obviously, such conditions should always be avoided.

(6) Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through zero ohms.

Operating Ratings⁽¹⁾⁽²⁾

Operating Temperature Range

−40°C ≤ T_A≤ +85°C

+2.7V to +5.25V

−0.3V to V_A

V_ASupply Voltage

Digital Input Pins Voltage Range

Clock Frequency

50 kHz to 16 MHz

0V to V_A

Analog Input Voltage

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the

Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may

degrade when the device is not operated under the listed test conditions.

(2) All voltages are measured with respect to GND = 0V, unless otherwise specified.

Package Thermal Resistance⁽¹⁾

Package

θ_JA

10-lead VSSOP

190°C / W

(1) Soldering process must comply with Reflow Temperature Profile specifications. Refer to www.ti.com/packaging. Reflow temperature

profiles are different for lead-free and non-lead-free packages.

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