Datasheet > 驱动程序和接口 > 线路驱动器或接收器> ADA4950-2YCPZ-RL

ADA4950-2YCPZ-RL

更新时间： 2024-01-07 14:05:08

品牌	Logo	应用领域
亚德诺 - ADI		线路驱动器或接收器驱动程序和接口接口集成电路 PC
页数	文件大小	规格书
28页	678K
描述
Low Power, Selectable Gain Differential ADC Driver, G = 1, 2, 3

阅读下载

中文翻译

获取价格

技术参数
数据手册
替代型号

如果您发现信息不准确，欢迎纠错

ADA4950-2YCPZ-RL 技术参数

是否无铅：	含铅	是否Rohs认证：	符合
生命周期：	Active	零件包装代码：	QFN
包装说明：	HVQCCN,	针数：	24
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8542.39.00.01	风险等级：	5.42
Samacsys Confidence：		Samacsys Status：	Released
Samacsys PartID：	340498	Samacsys Pin Count：	25
Samacsys Part Category：	Integrated Circuit	Samacsys Package Category：	Other
Samacsys Footprint Name：	QFN50P400X400X100-25N	Samacsys Released Date：	2017-01-11 11:21:59
Is Samacsys：	N	差分输出：	YES
驱动器位数：	2	输入特性：	DIFFERENTIAL
接口集成电路类型：	LINE DRIVER	接口标准：	GENERAL PURPOSE
JESD-30 代码：	S-XQCC-N24	JESD-609代码：	e3
长度：	4 mm	湿度敏感等级：	3
功能数量：	2	端子数量：	24
最高工作温度：	105 °C	最低工作温度：	-40 °C
封装主体材料：	UNSPECIFIED	封装代码：	HVQCCN
封装形状：	SQUARE	封装形式：	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度（摄氏度）：	260	认证状态：	Not Qualified
最大接收延迟：		座面最大高度：	1 mm
最大供电电压：	11 V	最小供电电压：	3 V
标称供电电压：	5 V	表面贴装：	YES
技术：	BIPOLAR	温度等级：	INDUSTRIAL
端子面层：	Matte Tin (Sn)	端子形式：	NO LEAD
端子节距：	0.5 mm	端子位置：	QUAD
处于峰值回流温度下的最长时间：	30	宽度：	4 mm
Base Number Matches：	1

ADA4950-2YCPZ-RL 数据手册

浏览型号ADA4950-2YCPZ-RL的Datasheet PDF文件第10页

ADA4950-1/ADA4950-2

ABSOLUTE MAXIMUM RATINGS

The power dissipated in the package (P_D) is the sum of the quies-

cent power dissipation and the power dissipated in the package

due to the load drive. The quiescent power is the voltage between

the supply pins (V_S) times the quiescent current (I_S). The power

dissipated due to the load drive depends upon the particular

application. The power dissipated due to the load drive is calcu-

lated by multiplying the load current by the associated voltage

drop across the device. RMS voltages and currents must be used

in these calculations.

Table 7.

Parameter

Rating

Supply Voltage

11 V

Power Dissipation

See Figure 4

±± ꢀm

Input Current, +INx, −INx, PD

Storage Teꢀperature Range

Operating Teꢀperature Range

mDm49±0-1

mDm49±0-2

Lead Teꢀperature (Soldering, 10 sec)

Junction Teꢀperature

−6±°C to +12±°C

−40°C to +10±°C

300°C

Airflow increases heat dissipation, effectively reducing θ_JA. In

addition, more metal directly in contact with the package leads/

exposed pad from metal traces, through holes, ground, and

power planes reduces θ_JA.

1±0°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Figure 4 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the single 16-lead

LFCSP (91°C/W) and the dual 24-lead LFCSP (65°C/W) on

a JEDEC standard 4-layer board with the exposed pad soldered

to a PCB pad that is connected to a solid plane.

3.5

THERMAL RESISTANCE

3.0

2.5

θ_JAis specified for the device (including exposed pad) soldered

to a high thermal conductivity 2s2p printed circuit board, as

described in EIA/JESD51-7.

2.0

ADA4950-2

Table 8. Thermal Resistance

Package Type

1.5

θ_JA

θ_JC

Unit

°C/W

ADA4950-1

mDm49±0-1, 16-Lead LFCSP (Exposed Pad) 91

mDm49±0-2, 24-Lead LFCSP (Exposed Pad) 6±

1.0

0.5

MAXIMUM POWER DISSIPATION

–40

–20

100

The maximum safe power dissipation in the ADA4950-x package

is limited by the associated rise in junction temperature (T_J) on

the die. At approximately 150°C, which is the glass transition

temperature, the plastic changes its properties. Even temporarily

exceeding this temperature limit can change the stresses that the

package exerts on the die, permanently shifting the parametric

performance of the ADA4950-x. Exceeding a junction temper-

ature of 150°C for an extended period can result in changes in

the silicon devices, potentially causing failure.

AMBIENT TEMPERATURE (°C)

Figure 4. Maximum Power Dissipation vs. Ambient Temperature

for a 4-Layer Board

ESD CAUTION

Rev. 0 | Page 7 of 28

1...4 5 678 9 10...28

中文翻译

下载PDF

ADA4950-2YCPZ-RL 替代型号

型号	品牌	替代类型	描述	数据表
ADA4950-2YCPZ-R7	ADI	完全替代	Low Power, Selectable Gain Differential ADC Driver, G = 1, 2, 3
ADA4950-2YCPZ-R2	ADI	类似代替	Low Power, Selectable Gain Differential ADC Driver, G = 1, 2, 3

与ADA4950-2YCPZ-RL相关器件

型号	品牌	获取价格	描述	数据表
ADA4960-1	ADI	获取价格	Low Distortion Ultrahigh Speed Differential ADC Driver
ADA4960-1_17	ADI	获取价格	5 GHz, Low Distortion lADC Driver/Line Driver
ADA4960-1ACP-EBZ	ADI	获取价格	5 GHz, Low Distortion lADC Driver/Line Driver
ADA4960-1ACPZ-R2	ADI	获取价格	5 GHz, Low Distortion ADC Driver/Line Driver
ADA4960-1ACPZ-R7	ADI	获取价格	5 GHz, Low Distortion ADC Driver/Line Driver
ADA4960-1ACPZ-RL	ADI	获取价格	暂无描述
ADA4961	ADI	获取价格	低失真3.2 GHz RF DGA
ADA4961ACPZN-R7	ADI	获取价格	Low Distortion, 3.2 GHz, RF DGA
ADA4961ACPZ-R7	ADI	获取价格	SPECIALTY TELECOM CIRCUIT
ADA600F	RSG	获取价格	Hight power & peak power, Parallel / master-slave / N+1 redundant (optional), Current moni

与ADA4950-2YCPZ-RL相关文章

NE5532P芯片资料：引脚说明、电气参数及替换型号推荐
2024-06-13

2
解读MMBT5401数据手册：电气参数及替换型号推荐
2024-06-13

3
深入解读BAV70数据手册：特性、电气参数及替换型号推荐
2024-06-13

4
74HC595D芯片引脚图及功能、参数介绍、替代型号推荐
2024-06-13

4

产品中心

服务支持

精选活动

关于我们

帮助中心

ADA4950-2YCPZ-RL

ADA4950-2YCPZ-RL 技术参数

ADA4950-2YCPZ-RL 数据手册

ADA4950-2YCPZ-RL 替代型号

与ADA4950-2YCPZ-RL相关器件

与ADA4950-2YCPZ-RL相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

ADA4950-2YCPZ-RL

ADA4950-2YCPZ-RL 技术参数

ADA4950-2YCPZ-RL 数据手册

ADA4950-2YCPZ-RL 替代型号

与ADA4950-2YCPZ-RL相关器件

与ADA4950-2YCPZ-RL相关文章

您还可以找

您在本页遇到什么问题？