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ADA4950-1YCPZ-R7 PDF预览

ADA4950-1YCPZ-R7

更新时间: 2024-02-15 01:07:03
品牌 Logo 应用领域
亚德诺 - ADI 驱动器接口集成电路
页数 文件大小 规格书
28页 678K
描述
Low Power, Selectable Gain Differential ADC Driver, G = 1, 2, 3

ADA4950-1YCPZ-R7 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:QFN
包装说明:HVQCCN,针数:16
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:1.26
差分输出:YES驱动器位数:1
输入特性:DIFFERENTIAL接口集成电路类型:LINE DRIVER
接口标准:GENERAL PURPOSEJESD-30 代码:S-XQCC-N16
JESD-609代码:e3长度:3 mm
湿度敏感等级:3功能数量:1
端子数量:16最高工作温度:105 °C
最低工作温度:-40 °C封装主体材料:UNSPECIFIED
封装代码:HVQCCN封装形状:SQUARE
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度(摄氏度):260
认证状态:Not Qualified最大接收延迟:
座面最大高度:1 mm最大供电电压:11 V
最小供电电压:3 V标称供电电压:5 V
表面贴装:YES技术:BIPOLAR
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn)
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:30
宽度:3 mmBase Number Matches:1

ADA4950-1YCPZ-R7 数据手册

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ADA4950-1/ADA4950-2  
ABSOLUTE MAXIMUM RATINGS  
The power dissipated in the package (PD) is the sum of the quies-  
cent power dissipation and the power dissipated in the package  
due to the load drive. The quiescent power is the voltage between  
the supply pins (VS) times the quiescent current (IS). The power  
dissipated due to the load drive depends upon the particular  
application. The power dissipated due to the load drive is calcu-  
lated by multiplying the load current by the associated voltage  
drop across the device. RMS voltages and currents must be used  
in these calculations.  
Table 7.  
Parameter  
Rating  
Supply Voltage  
11 V  
Power Dissipation  
See Figure 4  
±± ꢀm  
Input Current, +INx, −INx, PD  
Storage Teꢀperature Range  
Operating Teꢀperature Range  
mDm49±0-1  
mDm49±0-2  
Lead Teꢀperature (Soldering, 10 sec)  
Junction Teꢀperature  
−6±°C to +12±°C  
−40°C to +10±°C  
−40°C to +10±°C  
300°C  
Airflow increases heat dissipation, effectively reducing θJA. In  
addition, more metal directly in contact with the package leads/  
exposed pad from metal traces, through holes, ground, and  
power planes reduces θJA.  
1±0°C  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Figure 4 shows the maximum safe power dissipation in the  
package vs. the ambient temperature for the single 16-lead  
LFCSP (91°C/W) and the dual 24-lead LFCSP (65°C/W) on  
a JEDEC standard 4-layer board with the exposed pad soldered  
to a PCB pad that is connected to a solid plane.  
3.5  
THERMAL RESISTANCE  
3.0  
2.5  
θJA is specified for the device (including exposed pad) soldered  
to a high thermal conductivity 2s2p printed circuit board, as  
described in EIA/JESD51-7.  
2.0  
ADA4950-2  
Table 8. Thermal Resistance  
Package Type  
1.5  
θJA  
θJC  
28  
16  
Unit  
°C/W  
°C/W  
ADA4950-1  
mDm49±0-1, 16-Lead LFCSP (Exposed Pad) 91  
mDm49±0-2, 24-Lead LFCSP (Exposed Pad) 6±  
1.0  
0.5  
0
MAXIMUM POWER DISSIPATION  
–40  
–20  
0
20  
40  
60  
80  
100  
The maximum safe power dissipation in the ADA4950-x package  
is limited by the associated rise in junction temperature (TJ) on  
the die. At approximately 150°C, which is the glass transition  
temperature, the plastic changes its properties. Even temporarily  
exceeding this temperature limit can change the stresses that the  
package exerts on the die, permanently shifting the parametric  
performance of the ADA4950-x. Exceeding a junction temper-  
ature of 150°C for an extended period can result in changes in  
the silicon devices, potentially causing failure.  
AMBIENT TEMPERATURE (°C)  
Figure 4. Maximum Power Dissipation vs. Ambient Temperature  
for a 4-Layer Board  
ESD CAUTION  
Rev. 0 | Page 7 of 28  
 
 

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