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ADA4941-1YRZ-RL PDF预览

ADA4941-1YRZ-RL

更新时间： 2024-02-21 15:47:57
品牌 Logo 应用领域
亚德诺 - ADI 驱动器
页数 文件大小 规格书
24页 500K
描述
Single-Supply, Differential 18-Bit ADC Driver

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ADA4941-1YRZ-RL 技术参数

是否无铅：含铅是否Rohs认证：符合
生命周期：Active零件包装代码：SOIC
包装说明：SOP,针数：8
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：1.18
Samacsys Confidence：3Samacsys Status：Released
2D Presentation：https://componentsearchengine.com/2D/0T/3587.2.2.pngSchematic Symbol：https://componentsearchengine.com/symbol.php?partID=3587
PCB Footprint：https://componentsearchengine.com/footprint.php?partID=35873D View：https://componentsearchengine.com/viewer/3D.php?partID=3587
Samacsys PartID：3587Samacsys Image：https://componentsearchengine.com/Images/9/ADA4941-1YRZ.jpg
Samacsys Thumbnail Image：https://componentsearchengine.com/Thumbnails/2/ADA4941-1YRZ.jpgSamacsys Pin Count：8
Samacsys Part Category：Integrated CircuitSamacsys Package Category：Small Outline Packages
Samacsys Footprint Name：R-8 (SOIC)Samacsys Released Date：2015-04-16 09:48:08
Is Samacsys：N差分输出：YES
驱动器位数：1输入特性：DIFFERENTIAL
接口集成电路类型：LINE DRIVER接口标准：GENERAL PURPOSE
JESD-30 代码：R-PDSO-G8JESD-609代码：e3
长度：4.9 mm湿度敏感等级：1
功能数量：1端子数量：8
最高工作温度：125 °C最低工作温度：-40 °C
封装主体材料：PLASTIC/EPOXY封装代码：SOP
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
峰值回流温度（摄氏度）：260认证状态：Not Qualified
最大接收延迟：座面最大高度：1.75 mm
最大供电电压：12 V最小供电电压：2.7 V
标称供电电压：3 V表面贴装：YES
温度等级：AUTOMOTIVE端子面层：Matte Tin (Sn)
端子形式：GULL WING端子节距：1.27 mm
端子位置：DUAL处于峰值回流温度下的最长时间：30
宽度：3.9 mmBase Number Matches：1

ADA4941-1YRZ-RL 数据手册

 浏览型号ADA4941-1YRZ-RL的Datasheet PDF文件第3页浏览型号ADA4941-1YRZ-RL的Datasheet PDF文件第4页浏览型号ADA4941-1YRZ-RL的Datasheet PDF文件第5页浏览型号ADA4941-1YRZ-RL的Datasheet PDF文件第7页浏览型号ADA4941-1YRZ-RL的Datasheet PDF文件第8页浏览型号ADA4941-1YRZ-RL的Datasheet PDF文件第9页 
ADA4941-1  
ABSOLUTE MAXIMUM RATINGS  
Table 4.  
Parameter  
The power dissipated in the package (PD) is the sum of the  
quiescent power dissipation and the power dissipated in the  
package due to the load drive for all outputs. The quiescent  
power is the voltage between the supply pins (VS) times the  
quiescent current (IS). The power dissipated due to the load  
drive depends upon the particular application. For each output,  
the power due to load drive is calculated by multiplying the load  
current by the associated voltage drop across the device. The  
power dissipated due to all of the loads is equal to the sum of  
the power dissipation due to each individual load. RMS voltages  
and currents must be used in these calculations.  
Rating  
Supply Voltage  
Power Dissipation  
Storage Temperature Range  
Operating Temperature Range  
Lead Temperature (Soldering 10 sec)  
Junction Temperature  
12 V  
See Figure 3  
−65°C to +125°C  
−40°C to +85°C  
300°C  
150°C  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Airflow increases heat dissipation, effectively reducing θJA. In  
addition, more metal directly in contact with the package leads  
from metal traces, through holes, ground, and power planes  
reduces the θJA. The exposed paddle on the underside of the  
package must be soldered to a pad on the PCB surface that is  
thermally connected to a copper plane to achieve the specified θJA.  
THERMAL RESISTANCE  
θJA is specified for the worst-case conditions, that is, θJA is  
specified for a device soldered in the circuit board with its  
exposed paddle soldered to a pad (if applicable) on the PCB  
surface that is thermally connected to a copper plane, with zero  
airflow.  
Figure 3 shows the maximum safe power dissipation in the  
packages vs. the ambient temperature for the 8-lead SOIC  
(126°C/W) and for the 8-lead LFCSP (83°C/W) on a JEDEC  
standard 4-layer board. The LFCSP must have its underside  
paddle soldered to a pad that is thermally connected to a PCB  
plane. θJA values are approximations.  
Table 5. Thermal Resistance  
Package Type  
θJA  
θJC  
28  
19  
Unit  
°C/W  
°C/W  
8-Lead SOIC on 4-Layer Board  
126  
2.5  
8-Lead LFCSP with EP on 4-Layer Board 83  
2.0  
Maximum Power Dissipation  
The maximum safe power dissipation in the ADA4941-1  
LFCSP  
1.5  
package is limited by the associated rise in junction temperature  
(TJ) on the die. At approximately 150°C, which is the glass  
transition temperature, the plastic changes its properties. Even  
temporarily exceeding this temperature limit can change the  
stresses that the package exerts on the die, permanently shifting  
the parametric performance of the ADA4941-1. Exceeding a  
junction temperature of 150°C for an extended period can  
result in changes in the silicon devices potentially causing  
failure.  
1.0  
SOIC  
0.5  
0
–40  
–20  
0
20  
40  
60  
80  
100  
120  
AMBIENT TEMPERATURE (°C)  
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board  
ESD CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on  
the human body and test equipment and can discharge without detection. Although this product features  
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy  
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance  
degradation or loss of functionality.  
Rev. C | Page 6 of 24  
 
 
 
 
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