Datasheet > 放大器电路 > 运算放大器> ADA4940-1AR-EBZ

ADA4940-1AR-EBZ

更新时间： 2024-01-23 01:33:33

品牌	Logo	应用领域
亚德诺 - ADI		/
页数	文件大小	规格书
32页	919K
描述
Ultralow Power, Low Distortion

阅读下载

获取价格

技术参数
数据手册

如果您发现信息不准确，欢迎纠错

ADA4940-1AR-EBZ 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
零件包装代码：	SOIC	包装说明：	HSOP, SOP8,.25
针数：	8	Reach Compliance Code：	compliant
ECCN代码：	EAR99	HTS代码：	8542.33.00.01
风险等级：	5.8	Is Samacsys：	N
放大器类型：	OPERATIONAL AMPLIFIER	标称共模抑制比：	85 dB
JESD-30 代码：	R-PDSO-G8	长度：	4.9 mm
功能数量：	1	端子数量：	8
最高工作温度：	105 °C	最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY	封装代码：	HSOP
封装等效代码：	SOP8,.25	封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE, HEAT SINK/SLUG	峰值回流温度（摄氏度）：	NOT SPECIFIED
电源：	5 V	认证状态：	Not Qualified
座面最大高度：	1.75 mm	标称压摆率：	90 V/us
子类别：	Operational Amplifier	标称供电电压 (Vsup)：	5 V
表面贴装：	YES	技术：	BIPOLAR
温度等级：	INDUSTRIAL	端子形式：	GULL WING
端子节距：	1.27 mm	端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED	宽度：	3.9 mm
Base Number Matches：	1

ADA4940-1AR-EBZ 数据手册

Data Sheet

ADA4940-1/ADA4940-2

ABSOLUTE MAXIMUM RATINGS

Table 9.

The power dissipated in the package (P_D) is the sum of the

quiescent power dissipation and the power dissipated in the

package due to the load drive for all outputs. The quiescent

power dissipation is the voltage between the supply pins ( V_S)

times the quiescent current (I_S). The load current consists of the

differential and common-mode currents flowing to the load, as

well as currents flowing through the external feedback networks

and internal common-mode feedback loop. The internal

resistor tap used in the common-mode feedback loop places a

negligible differential load on the output. RMS voltages and

currents should be considered when dealing with ac signals.

Parameter

Rating

Supply Voltage

V_OCM

8 V

V_S

1.2 V

−40°C to +125°C

−65°C to +150°C

300°C

Differential Input Voltage

Operating Temperature Range

Storage Temperature Range

Lead Temperature (Soldering, 10 sec)

Junction Temperature

ESD

150°C

Field Induced Charged Device Model (FICDM)

Human Body Model (HBM)

1250 V

2000 V

Airflow reduces θ_JA. In addition, more metal directly in contact

with the package leads from metal traces, through holes, ground,

and power planes reduces the θ_JA.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Figure 3 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the 8-lead SOIC (θ_JA=

158°C/W, single)the 16-lead LFCSP (θ_JA= 91.3°C/W, single) and

24-lead LFCSP (θ_JA= 65.1°C /W, dual) packages on a JEDEC

standard 4-layer board. θ_JAvalues are approximations.

3.5

THERMAL RESISTANCE

3.0

θ_JAis specified for the worst-case conditions, that is, θ_JAis

specified for the device soldered on a circuit board in still air.

ADA4940-2 (LFCSP)

2.5

Table 10.

Package Type

ADA4940-1 (LFCSP)

2.0

θ_JA

Unit

°C/W

8-Lead SOIC (Single)/4-Layer Board

16-Lead LFCSP (Single)/4-Layer Board

24-Lead LFCSP (Dual)/4-Layer Board

158

91.3

65.1

1.5

1.0

ADA4940-1 (SOIC)

0.5

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation in the ADA4940-1/

ADA4940-2 packages is limited by the associated rise in

junction temperature (T_J) on the die. At approximately 150°C,

which is the glass transition temperature, the plastic changes its

properties. Even temporarily exceeding this temperature limit

can change the stresses that the package exerts on the die,

permanently shifting the parametric performance of the

ADA4940-1/ADA4940-2. Exceeding a junction temperature

of 150°C for an extended period can result in changes in the

silicon devices, potentially causing failure.

–40

–20

100

120

AMBIENT TEMPERATURE (°C)

Figure 3. Maximum Safe Power Dissipation vs. Ambient Temperature

ESD CAUTION

Rev. B | Page 7 of 32

1...4 5 678 9 10...32

下载PDF

与ADA4940-1AR-EBZ相关器件

型号	品牌	描述	获取价格	数据表
ADA4940-1ARZ	ADI	Ultralow Power, Low Distortion	获取价格
ADA4940-1ARZ-R7	ADI	Ultralow Power, Low Distortion	获取价格
ADA4940-1ARZ-RL	ADI	Ultralow Power, Low Distortion	获取价格
ADA4940-2	ADI	Ultralow Power, Low Distortion	获取价格
ADA4940-2ACP-EBZ	ADI	Ultralow Power, Low Distortion	获取价格
ADA4940-2ACPZ-R2	ADI	Ultralow Power, Low Distortion	获取价格

产品中心

服务支持

精选活动

关于我们

帮助中心

ADA4940-1AR-EBZ

ADA4940-1AR-EBZ 技术参数

ADA4940-1AR-EBZ 数据手册

与ADA4940-1AR-EBZ相关器件

与ADA4940-1AR-EBZ相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

ADA4940-1AR-EBZ

ADA4940-1AR-EBZ 技术参数

ADA4940-1AR-EBZ 数据手册

与ADA4940-1AR-EBZ相关器件

与ADA4940-1AR-EBZ相关文章

您还可以找

您在本页遇到什么问题？