Datasheet > ADA4932-2YCPZ-R71

ADA4932-2YCPZ-R71

更新时间： 2022-04-12 17:14:32

品牌	Logo	应用领域
亚德诺 - ADI		驱动器
页数	文件大小	规格书
28页	477K
描述
Low Power Differential ADC Driver

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ADA4932-1/ADA4932-2

LAYOUT, GROUNDING, AND BYPASSING

As a high speed device, the ADA4932-x is sensitive to the

PCB environment in which it operates. Realizing its superior

performance requires attention to the details of high speed

PCB design.

Bypass the power supply pins as close to the device as possible

and directly to a nearby ground plane. High frequency ceramic

chip capacitors should be used. It is recommended that two

parallel bypass capacitors (1000 pF and 0.1 μF) be used for each

supply. Place the 1000 pF capacitor closer to the device. Further

away, provide low frequency bulk bypassing using 10 μF tantalum

capacitors from each supply to ground.

The first requirement is a solid ground plane that covers as much

of the board area around the ADA4932-x as possible. However,

the area near the feedback resistors (R_F), gain resistors (R_G), and

the input summing nodes (Pin 2 and Pin 3) should be cleared of

all ground and power planes (see Figure 64). Clearing the ground

and power planes minimizes any stray capacitance at these nodes

and thus minimizes peaking of the response of the amplifier at

high frequencies.

Signal routing should be short and direct to avoid parasitic effects.

Wherever complementary signals exist, provide a symmetrical

layout to maximize balanced performance. When routing

differential signals over a long distance, keep PCB traces close

together, and twist any differential wiring to minimize loop

area. Doing this reduces radiated energy and makes the circuit

less susceptible to interference.

The thermal resistance, θ_JA, is specified for the device, including

the exposed pad, soldered to a high thermal conductivity 4-layer

circuit board, as described in EIA/JESD51-7.

1.30

0.80

1.30 0.80

Figure 64. Ground and Power Plane Voiding in Vicinity of R_Fand R_G

Figure 65. Recommended PCB Thermal Attach Pad Dimensions (Millimeters)

1.30

TOP METAL

GROUND PLANE

0.30

PLATED

VIA HOLE

POWER PLANE

BOTTOM METAL

Figure 66. Cross-Section of 4-Layer PCB Showing Thermal Via Connection to Buried Ground Plane (Dimensions in Millimeters)

Rev. A | Page 24 of 28

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