Datasheet > AD8411A

AD8411A

更新时间： 2023-12-20 18:45:53

品牌	Logo	应用领域
亚德诺 - ADI		放大器
页数	文件大小	规格书
25页	1727K
描述
?2 V至70 V宽输入电压范围、2.7 MHz高带宽、具有PWM抑制和50 V/V增益的电流检测放大器

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AD8411A 数据手册

Data Sheet

AD8411A

ABSOLUTE MAXIMUM RATINGS

Table 2. Absolute Maximum Ratings

ELECTROSTATIC DISCHARGE (ESD) RATINGS

Parameter

Rating

The following ESD information is provided for handling of ESD-sen-

sitive devices in an ESD protected area only.

Supply Voltage (V_Sto GND)

Input Voltage Range, Continuous

Common-Mode

6 V

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

+IN to GND

−20 V to +85 V

Field-induced robotic charged device model (FICDM) per ANSI/ES-

DA/JEDEC JS-002.

−IN to GND

Differential

+IN to −IN

± 20 V

ESD Ratings for AD8411A

V_REF1, V_REF

GND − 0.3 V to V_S+ 0.3 V

0.3 V

Table 4. AD8411A, 8-Lead SOIC_N

Reverse Supply Voltage

Temperature

ESD Model

Withstand Threshold (V)

Class

Operating Range

−40°C to +125°C

−65°C to +150°C

Indefinite

FICDM

±1000

Storage Range

Table 5. AD8411A, 8-Lead MSOP

Output Short-Circuit Duration

ESD Model

Withstand Threshold (V)

Class

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

HBM

±4000

±1250

FICDM

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θ_JAis the natural convection, junction-to-ambient thermal resistance

measured in a one cubic foot sealed enclosure. θ_JBis the junction-

to-board thermal resistance. θ_JCTis the junction-to-case thermal

resistance.

Table 3. Thermal Resistance

Package Type¹

θ_JA

θ_JB

θ_JCT

Unit

R-8

142.8

152

140.6

120.6

64.01

59.7

°C/W

RM-8

Thermal impedance simulated values are based on a JEDEC 2S2P thermal

test board for θ_JA, JEDEC 2S2P thermal impedance with ring style cold plate

attached to PCB for θ_JB, and a JEDEC 1S0P thermal test board for θ_JCT. Refer

to JEDEC JESD-51.

analog.com

Rev. A | 6 of 25

1...3 4 567 8 9...25

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