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AD8330ARQZ-RL

更新时间： 2024-02-06 23:39:05

品牌	Logo	应用领域
亚德诺 - ADI		放大器
页数	文件大小	规格书
32页	751K
描述
Low Cost DC to 150 MHz Variable Gain Amplifier

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数据手册

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AD8330ARQZ-RL 数据手册

AD8330

OUTLINE DIMENSIONS

0.50

0.40

0.30

0.60 MAX

3.00

BSC SQ

PIN 1

INDICATOR

BOTTOM VIEW

1.65

1.50 SQ

1.35

0.45

PIN 1

INDICATOR

2.75

BSC SQ

TOP

VIEW

EXPOSED

PAD

0.50

BSC

0.25 MIN

1.50 REF

0.80 MAX

12° MAX

THE EXPOSED PAD IS NOT CONNECTED

INTERNALLY. FOR INCREASED RELIABILITY

OF THE SOLDER JOINTS AND MAXIMUM

THERMAL CAPABILITY, IT IS RECOMMENDED

THAT THE PADDLE BE SOLDERED TO THE

GROUND PLANE.

0.65 TYP

0.90

0.85

0.80

0.05 MAX

0.02 NOM

SEATING

PLANE

0.30

0.23

0.18

0.20 REF

COMPLIANT TO JEDEC STANDARDS MO-220-VEED-2

EXCEPT FOR EXPOSED PAD DIMENSION.

Figure 69. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

3 mm × 3 mm Body, Very Thin Quad

(CP-16-3)

Dimensions shown in millimeters

0.197

0.193

0.189

0.158

0.154

0.150

0.244

0.236

0.228

PIN 1

0.069

0.053

0.065

0.049

8°

0°

0.010

0.004

0.025

BSC

0.012

0.008

0.050

0.016

SEATING

PLANE

0.010

0.006

COPLANARITY

0.004

COMPLIANT TO JEDEC STANDARDS MO-137-AB

Figure 70. 16-Lead Shrink Small Outline Package [QSOP]

(RQ-16)

Dimensions shown in inches

Rev. C | Page 28 of 32

1...25 26 272829 30 31 32

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