AD8324
OUTLINE DIMENSIONS
0.60
4.00
PIN 1
MAX
BSC SQ
INDICATOR
0.60
MAX
20
1
16
15
PIN 1
INDICATOR
2.25
TOP
VIEW
3.75
BCS SQ
2.10 SQ
1.95
11
10
5
6
0.75
0.55
0.35
0.25 MIN
0.80 MAX
0.65 TYP
0.30
0.23
0.18
12° MAX
1.00
0.85
0.80
0.05 MAX
0.02 NOM
0.20
REF
SEATING
PLANE
COPLANARITY
0.08
0.50
BSC
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1
Figure 30. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad (CP-20-1)
Dimensions shown in millimeters
0.341
BSC
20
1
11
10
0.154
BSC
0.236
BSC
PIN 1
0.065
0.049
0.069
0.053
8°
0°
0.010
0.004
0.025
BSC
0.012
0.008
SEATING
PLANE
0.050
0.016
0.010
0.006
COPLANARITY
0.004
COMPLIANT TO JEDEC STANDARDS MO-137-AD
Figure 31. 20-Lead Shrink Small Outline Package [QSOP] (RQ-20)
Dimensions shown in inches
ORDERING GUIDE
Model
AD8324JRQ
Temperature Range
Package Description
20-Lead QSOP
20-Lead QSOP
20-Lead QSOP
20-Lead QSOP
Package Option
RQ-20
RQ-20
RQ-20
RQ-20
RQ-20
RQ-20
CP-20-1
CP-20-1
CP-20-1
CP-20-1
–25°C to +70°C
–25°C to +70°C
–25°C to +70°C
–25°C to +70°C
–25°C to +70°C
–25°C to +70°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
AD8324JRQ-REEL
AD8324JRQ-REEL7
AD8324JRQZ1
AD8324JRQZ-REEL1
AD8324JRQZ-REEL71
AD8324ACP
20-Lead QSOP
20-Lead QSOP
20-Lead LFCSP_VQ
20-Lead LFCSP_VQ
20-Lead LFCSP_VQ
20-Lead LFCSP_VQ
Evaluation Board
Evaluation Board
AD8324ACP-REEL7
AD8324ACPZ1
AD8324ACPZ-REEL71
AD8324JRQ-EVAL
AD8324ACP-EVAL
1 Z = Pb-free part.
©
2005 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
C04339–0–7/05(A)
Rev. A | Page 16 of 16