AD8021
ABSOLUTE MAXIMUM RATINGS1
2.0
1.5
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26.4 V
Power Dissipation . . . . . . . . Observed Power Derating Curves
Input Voltage (Common-Mode) . . . . . . . . . . . . . . . ±VS ± 1 V
Differential Input Voltage2 . . . . . . . . . . . . . . . . . . . . . . ±0.8 V
Differential Input Current . . . . . . . . . . . . . . . . . . . . . ±10 mA
Output Short-Circuit Duration
8-LEAD SOIC
1.0
. . . . . . . . . . . . . . . . . . . . . . Observed Power Derating Curves
Storage Temperature . . . . . . . . . . . . . . . . . . –65∞C to +125∞C
Operating Temperature Range . . . . . . . . . . . –40∞C to +85∞C
Lead Temperature Range (Soldering, 10 sec) . . . . . . . . 300∞C
8-LEAD MSOP
0.5
NOTES
1 Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only and functional operation of
the device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2 The AD8021 inputs are protected by diodes. Current-limiting resistors are not
used in order to preserve the low noise. If a differential input exceeds ±0.8 V, the
input current should be limited to ±10 mA.
0.01
–55 –45 –35 –25 –15 –5
5 15 25 35 45 55 65 75 85
AMBIENT TEMPERATURE (؇C)
Figure 2. Maximum Power Dissipation vs. Temperature*
*Specification is for device in free air:
8-Lead SOIC: JA = 125∞C/W
8-Lead MSOP: JA = 145∞C/W
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD8021
is limited by the associated rise in junction temperature. The maxi-
mum safe junction temperature for plastic encapsulated devices
is determined by the glass transition temperature of the plastic,
approximately 150∞C. Temporarily exceeding this limit may cause
a shift in parametric performance due to a change in the stresses
exerted on the die by the package. Exceeding a junction tempera-
ture of 175∞C for an extended period can result in device failure.
PIN FUNCTION DESCRIPTIONS
Pin No. Mnemonic
Function
1
LOGIC REFERENCE Reference for Pin 8* Voltage
Level. Connect to logic low
supply.
2
3
4
5
–IN
+IN
–VS
Inverting Input
Noninverting Input
Negative Supply Voltage
Compensation Capacitor. Tie
to –VS. (See the Applications
section for value.)
While the AD8021 is internally short-circuit protected, this may
not be sufficient to guarantee that the maximum junction tem-
perature (150∞C) is not exceeded under all conditions. To ensure
proper operation, it is necessary to observe the maximum power
derating curves.
CCOMP
6
7
8
VOUT
Output
Positive Supply Voltage
Disable, Active Low*
+VS
DISABLE
PIN CONFIGURATION
*When Pin 8 (DISABLE) is about 2 V or more higher than Pin 1 (LOGIC
REFERENCE), the part is enabled. When Pin 8 is brought down to within about
1.5 V of Pin 1, the part is disabled. (See the Specification tables for exact disable and
enable voltage levels.) If the disable feature is not going to be used, Pin 8 can be tied
to +VS or a logic high source, and Pin 1 can be tied to ground or logic low. Alterna-
tively, if Pin 1 and Pin 8 are not connected, the part will be in an enabled state.
AD8021
LOGIC
1
2
3
4
8
7
6
5
DISABLE
REFERENCE
+V
S
–IN
V
+IN
OUT
C
–V
S
COMP
ORDERING GUIDE
Model
AD8021AR
AD8021AR-REEL
AD8021AR-REEL7
AD8021ARM
AD8021ARM-REEL
AD8021ARM-REEL7
AD8021ARZ*
AD8021ARZ-REEL*
AD8021ARZ-REEL7*
Temperature Range
Package Description
Package Outline
Branding
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
8-Lead SOIC
8-Lead SOIC
8-Lead SOIC
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead SOIC
8-Lead SOIC
8-Lead SOIC
R-8
R-8
R-8
RM-8
RM-8
RM-8
R-8
HNA
HNA
HNA
R-8
R-8
*Z = Lead Free
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AD8021 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
REV. D
–5–
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